University of California

Lawrence Livermore National Security, LLC

Other

United Technologies Corporation

Brent C Stuart

Michael Dale Perry

Paul S Banks

Hoang Tan Nguyen

Gaylen V Erbert

Steve Telford

Joseph M Bartolick

Subrat Biswal

Muriel Y Ishikawa

Luiz B Da Silva

Lloyd A Hackel

Alexander M Rubenchik

Dennis L Matthews

Joseph Neev

Michael D Feit

Scott N Fochs

Michael E Glinsky

Lowell L Wood

James P Armstrong

Joseph A Sefcik

Booth R Myers

John K Crane

Mark R Hermann

E Michael Campbell

An optical transconductance varistor system having a modulated radiation source configured to provide modulated stimulus, a wavelength converter operably connected to the modulated radiation source to produce a modulated stimulus having a predetermined wavelength, and a wide bandgap semiconductor photoconductive material in contact between two electrodes. The photoconductive material is operably coupled, such as by a beam transport module, to receive the modulated stimulus having the predetermined wavelength to control a current flowing through the photoconductive material when a voltage potential is present across the electrodes.

Laser-controlled optical transconductance varistor system

A countermeasure system for use by a target to protect against an incoming sensor-guided threat. The system includes a laser system for producing a broadband beam and means for directing the broadband beam from the target to the threat. The countermeasure system comprises the steps of producing a broadband beam and directing the broad band beam from the target to blind or confuse the incoming sensor-guided threat.

Sensor-guided threat countermeasure system

A method for removing material via a laser so as to reduce the formation of channels comprising the steps of emitting a laser pulse comprising a pulse energy, a pulse duration, and a fluence towards a surface of a drilling material the fluence of a value sufficient to avoid the formation of a channel in the drilling material at the surface to form a hole comprising a side wall and a bottom, shaping a spatial profile of the laser pulse such that the fluence is substantially uniform across the spatial profile; and emitting at least one subsequent laser pulse having a pulse energy, a pulse duration, and a fluence sufficient to avoid the formation of a channel at the bottom of the hole.

Method of short pulse hole drilling without a resultant pilot hole and backwall damage

A diode pumped, high power (at least 20W), short pulse (up to 2 ps), chirped pulse amplified laser using Yb:YAG as the gain material is employed for material processing. Yb:YAG is used as the gain medium for both a regenerative amplifier and a high power 4-pass amplifier. A single common reflective grating optical device is used to both stretch pulses for amplification purposes and to recompress amplified pulses before being directed to a workpiece.

Application of Yb:YAG short pulse laser system

The present invention provides an easily aligned, all-reflective, aberration-free pulse stretcher-compressor in a compact geometry. The stretcher-compressor device is a reflective multi-layer dielectric that can be utilized for high power chirped-pulse amplification material processing applications. A reflective grating element of the device is constructed: 1) to receive a beam for stretching of laser pulses in a beam stretcher beam path and 2) to also receive stretched amplified pulses to be compressed in a compressor beam path through the same (i.e., common) reflective multilayer dielectric diffraction grating. The stretched and compressed pulses are interleaved about the grating element to provide the desired number of passes in each respective beam path in order to achieve the desired results.

Short pulse laser stretcher-compressor using a single common reflective grating

The invention consists of a method for high precision machining (cutting, drilling, sculpting) of metals and alloys. By using pulses of a duration in the range of 10 femtoseconds to 100 picoseconds, extremely precise machining can be achieved with essentially no heat or shock affected zone. Because the pulses are so short, there is negligible thermal conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond approximately 0.1-1 micron (dependent upon the particular material) from the laser machined surface. Due to the short duration, the high intensity (>10 W/cm ) associated with the interaction converts the material directly from the solid-state into an ionized plasma. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces with negligible redeposition either within the kerf or on the surface. Since there is negligible heating beyond the depth of material removed, the composition of the remaining material is unaffected by the laser machining process. This enables high precision machining of alloys and even pure metals with no change in grain structure.

Ultrashort pulse laser machining of metals and alloys

The composition analysis by scanning femtosecond ultraprobing (CASFLU) technology scans a focused train of extremely short-duration, very intense laser pulses across a sample. The partially-ionized plasma ablated by each pulse is spectrometrically analyzed in real time, determining the ablated material's composition. The steering of the scanned beam thus is computer directed to either continue ablative material-removal at the same site or to successively remove nearby material for the same type of composition analysis. This invention has utility in high-speed chemical-elemental, molecular-fragment and isotopic analyses of the microstructure composition of complex objects, e.g., the oxygen isotopic compositions of large populations of single osteons in bone.

Composition analysis by scanning femtosecond laser ultraprobing (CASFLU).

Short pulse PLD is a viable technique of producing high quality films with properties very close to that of crystalline diamond. The plasma generated using femtosecond lasers is composed of single atom ions with no clusters producing films with high Sp /Sp ratios. Using a high average power femtosecond laser system, the present invention dramatically increases deposition rates to up to 25 &mgr;m/hr (which exceeds many CVD processes) while growing particulate-free films. In the present invention, deposition rates is a function of laser wavelength, laser fluence, laser spot size, and target/substrate separation. The relevant laser parameters are shown to ensure particulate-free growth, and characterizations of the films grown are made using several diagnostic techniques including electron energy loss spectroscopy (EELS) and Raman spectroscopy.

Ultrashort pulse laser deposition of thin films

The present invention is a method for penetrating a workpiece using an ultra-short pulse laser beam without causing damage to subsequent surfaces facing the laser. Several embodiments are shown which place holes in fuel injectors without damaging the back surface of the sack in which the fuel is ejected. In one embodiment, pulses from an ultra short pulse laser remove about 10 nm to 1000 nm of material per pulse. In one embodiment, a plasma source is attached to the fuel injector and initiated by common methods such as microwave energy. In another embodiment of the invention, the sack void is filled with a solid. In one other embodiment, a high viscosity liquid is placed within the sack. In general, high-viscosity liquids preferably used in this invention should have a high damage threshold and have a diffusing property.

Method to reduce damage to backing plate

A method and apparatus for improving the quality and efficiency of machining of materials with laser pulse durations shorter than 100 picoseconds by orienting and maintaining the polarization of the laser light such that the electric field vector is perpendicular relative to the edges of the material being processed. Its use is any machining operation requiring remote delivery and/or high precision with minimal collateral dames.

Method and apparatus for improving the quality and efficiency of ultrashort-pulse laser machining

The invention consists of a method for machining (cutting, drilling, sculpting) of explosives (e.g., TNT, TATB, PETN, RDX, etc.). By using pulses of a duration in the range of 5 femtoseconds to 50 picoseconds, extremely precise and rapid machining can be achieved with essentially no heat or shock affected zone. In this method, material is removed by a nonthermal mechanism. A combination of multiphoton and collisional ionization creates a critical density plasma in a time scale much shorter than electron kinetic energy is transferred to the lattice. The resulting plasma is far from thermal equilibrium. The material is in essence converted from its initial solid-state directly into a fully ionized plasma on a time scale too short for thermal equilibrium to be established with the lattice. As a result, there is negligible heat conduction beyond the region removed resulting in negligible thermal stress or shock to the material beyond a few microns from the laser machined surface. Hydrodynamic expansion of the plasma eliminates the need for any ancillary techniques to remove material and produces extremely high quality machined surfaces. There is no detonation or deflagration of the explosive in the process and the material which is removed is rendered inert.

Laser machining of explosives

An all-reflective pulse stretcher for laser systems employing chirped-pulse amplification enables on-axis use of the focusing mirror which results in ease of use, significantly decreased sensitivity to alignment and near aberration-free performance. By using a new type of diffraction grating which contains a mirror incorporated into the grating, the stretcher contains only three elements: 1) the grating, 2) a spherical or parabolic focusing mirror, and 3) a flat mirror. Addition of a fourth component, a retro-reflector, enables multiple passes of the same stretcher resulting in stretching ratios beyond the current state of the art in a simple and compact design. The pulse stretcher has been used to stretch pulses from 20 fsec to over 600 psec (a stretching ratio in excess of 30,000).

Aberration-free, all-reflective laser pulse stretcher

A method and apparatus is disclosed for fast, efficient, precise and damage-free biological tissue removal using an ultrashort pulse duration laser system operating at high pulse repetition rates. The duration of each laser pulse is on the order of about 1 fs to less than 50 ps such that energy deposition is localized in a small depth and occurs before significant hydrodynamic motion and thermal conduction, leading to collateral damage, can take place. The depth of material removed per pulse is on the order of about 1 micrometer, and the minimal thermal and mechanical effects associated with this ablation method allows for high repetition rate operation, in the region 10 to over 1000 Hertz, which, in turn, achieves high material removal rates. The input laser energy per ablated volume of tissue is small, and the energy density required to ablate material decreases with decreasing pulse width. The ablation threshold and ablation rate are only weakly dependent on tissue type and condition, allowing for maximum flexibility of use in various biological tissue removal applications. The use of a chirped-pulse amplified Titanium-doped sapphire laser is disclosed as the source in one embodiment.

Growing community of inventors

Livermore, CA, United States of America

Brent C Stuart