International Business Machines Corporation

Globalfoundries Inc.

Brent A Goplen

Edmund Juris Sprogis

Robert Mark Rassel

Howard Smith Landis

Daniel Scott Vanslette

Pavan Y Bashaboina

Jeffrey P Bonn

Brian L Kinsman

Embodiments of the invention provide an integrated circuit (IC) having reduced through silicon via (TSV)-induced stresses and related IC design structures and methods. In one embodiment, the invention includes a method of designing an integrated circuit (IC) having reduced substrate stress, the method including: placing in an IC design file a plurality of through silicon via (TSV) placeholder cells, each placeholder cell having an undefined TSV orientation; replacing a first portion of the plurality of TSV placeholder cells with a first group of TSV cells having a first orientation; and replacing a second portion of the plurality of TSV placeholder cells with a second group of TSV cells having a second orientation substantially perpendicular to the first orientation, wherein TSV cells having the first orientation and TSV cells having the second orientation are interspersed to reduce a TSV-induced stress in an IC substrate.

Integrated circuit and design structure having reduced through silicon via-induced stress

Variation of a parameter of interest is reduced over a field of interest in, for example, an object design, such as a circuit design. The field of interest is divided into tiles. A parameter value is found for each tile and for a group of tiles around each tile. Using these values, variation of the parameter is determined. An adjusted value of the parameter for each tile is determined taking limits into account, iterating until variation is below a threshold value. Parameter uniformity is improved in some applications by over 30% with runtime reduced by an order of magnitude.

Parameter variation improvement

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Underhill, VT, United States of America

Brent A Goplen