Stmicroelectronics (rousset) Sas

Stmicroelectronics R&d Limited

Nexcis

Brendan Dunne

Olivier Gagliano

Kevin Channon

Eric Christison

Robert Nicol

Roberto Mionetto

Robert Ronchi

Caroline Fossati

A treatment of thin layers for forming a connection of a photovoltaic cell including the thin layers, which includes a first layer, having photovoltaic properties, deposited on a second layer, and the second layer, which is a metal contact layer, deposited on a substrate, the treatment including etching, in the first layer, at least one first trench having a first width so as to expose the second layer; and etching, in the first trench, a second trench so as to expose the substrate, the second trench having a second width less than the first width.

Laser etching a stack of thin layers for a connection of a photovoltaic cell

A method for stacking and interconnecting integrated circuits includes providing at least two substrates; forming a trench in each substrate; filling the trench with an insulating material; forming, in each substrate, at least one conductive area; thinning each substrate until reaching at least the bottom of the trench, to obtain in each substrate at least one electrically insulated region within the closed perimeter delineated by the trench; bonding the substrates together; making at least one hole through the bonded substrates so that the hole passes at least partially through the conductive areas and passes through the insulated region of each substrate; and filling the hole with an electrically conductive material so as to obtain a conductive column that traverses the isolated region of each substrate and is in lateral electrical contact with the conductive areas.

Chip stack with conductive column through electrically insulated semiconductor region

Method for stacking and interconnecting integrated circuits

A method for manufacturing a micro-module for capturing images having an imager and at least one lens, includes manufacturing at least one imager on a first plate of a semiconductor material, producing at least one optical zone to form a lens in at least one second plate of a transparent material, and of assembling the first and second plates so that the imager can receive light through the optical zone.

Method of manufacturing lenses, in particular for an integrated imager

A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

Method of manufacturing an image sensing micromodule

A CMOS imager includes a photosite array and a microlens array. The microlens array comprises microlenses of a first type and microlenses of a second type, the microlenses of first type being manufactured according to a first circular template having a first radius, the microlenses of second type being manufactured according to a second circular template having a second radius inferior to the first radius, and the first and second templates having overlap areas. One advantage is that the CMOS imager has a high fill rate.

Growing community of inventors

Gardanne, France

Brendan Dunne