Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Visteon Global Tech., Inc

Brenda Joyce Nation

Delin Li

Achyuta Achari

Lakhi Nandlal Goenka

Jay DeAvis Baker

Andrew Zachary Glovatsky

Mohan R Paruchuri

John Trublowski

Robert Edward Belke

Lawrence LeRoy Kneisel

Myron Lemecha

Thomas Bernd Krautheim

Robert Joseph Gordon

Charles Frederick Schweitzer

Guilian Gao

Richard Keith McMillan

Daniel Phillip Dailey

Vivek Amir Jairazbhoy

Peter Joseph Sinkunas

Vladimir Stoica

Edward Paul McLeskey

Peter Langer

Vinh Van Ha

Chin-Yuan Perng

Jeff J Lin

Karen M Adams

Alice Dawn Zitzmann

Michael Bednarz

Walter Kuzma Stepanenko

Cindy Maria Rutyna

An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

Integrated light and accessory assembly

A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Circuit board with air-bridge

An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site and an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the engine side of the bulkhead for thermal cooling of the flatwire electronic site. A cover is attached to the bulkhead which encloses a flatwire electronic site for environmental protection.

Underhood electronic integration

A method for making a multi-layer circuit board having apertures which may be selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material Each of the apertures selectively receives electrically conductive material

Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material

A method for making and repairing connections between first and second circuits, such as flex circuits. An article includes: a flexible dielectric substrate having first and second edges and a plurality of conductive circuit traces arranged on or within the substrate, wherein each of the traces extends from proximate the first edge to proximate the second edge Each of the circuit traces includes: a first connection feature disposed proximate the first edge a second connection feature disposed proximate the second edge and at least one third connection feature disposed between the first and second edges Each of the first, second, and third connection features is a plated through hole, a plated blind via, or a mounting pad. This article may be used to connect together the first and second circuits using the first and second connection features such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article may be cut so as to present a set of third connection features to which a new replacement circuit may be connected.

Method for the connection and repair of flex and other circuits

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

Method for constructing multilayer circuit boards having air bridges

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically connected to a source of ground potential.

Method for making a circuit board

A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Cladded material construction for etched-tri-metal circuits

A method for making a multi-layer electronic circuit board having electroplated apertures which may be selectively and electrically isolated from an electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material

Circuit board and a method for making the same

An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.

Environmentally-sealed electronic assembly and method of making same

An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article,includes: a flexible dielectric substrate,having first and second edges,, and a plurality of conductive circuit traces,arranged on or within the substrate, wherein each of the traces extends from proximate the first edge,to proximate the second edge,. Each of the circuit traces,includes: a first connection feature,disposed proximate the first edge,; a second connection feature,disposed proximate the second edge,; and at least one third connection feature,disposed between the first and second edges,. Each of the first, second, and third connection features,is a plated through hole, a plated blind via, or a mounting pad. This article,may be used to connect together the first and second circuits,using the first and second connection features,, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article,may be cut so as to present a set of third connection features,to which a new replacement circuit may be connected.

Method and article for the connection and repair of flex and other circuits

A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate,having a first edge,and first and second edge regions,, wherein at least the first edge region,is defined along the first edge,; (b) a first array,of electrical connection features,disposed on or within the substrate proximate the first edge region,; (c) a second array,of electrical connection features,disposed on or within the substrate proximate the second edge region,, wherein the second array,is substantially a duplication or a mirror image of the first array,; and (d) a plurality of circuit traces,disposed on or within the substrate such that each electrical connection feature,of the first array,is connected by one of the circuit traces,to a corresponding electrical connection feature,of the second array

Multi-connectable printed circuit board

An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50. The desiccant element 50 includes: a case 51 having an internal chamber, an inlet orifice 58, and an outlet orifice 59, wherein the inlet and outlet orifices are each in communication with the internal chamber; a predetermined amount of desiccant material 53 contained within the internal chamber; a normally-open interior valve 54 situated between the inlet orifice 58 and the internal chamber; a normally-closed exterior valve 56 situated between the outlet orifice 59 and the internal chamber; and heating means 52 for selectably heating the desiccant material 53 preferably above a regeneration temperature thereof. The desiccant element 50 is situated such that at least the interior orifice 54 thereof is sealably enclosed within the closed pocket 20.

Method for protecting electronic components

A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression headcap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The compression headcap includes two generally parallel wiper blades that are biased into sliding communication with the stencil. Longitudinal diffuser plates guide and equalize the flow of the viscous material into the volume between two generally parallel wiper blades.

Method and apparatus for dispensing viscous material

Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.

Growing community of inventors

Troy, MI, United States of America

Brenda Joyce Nation