Vlt Corporation

Other

Texas Instruments Corporation

Semiconductor Components Industries, LLC

Brant T Johnson

Patrizio Vinciarelli

Fred M Finnemore

John S Balog

John R Saxelby, Jr

James Henry Aliberti

Daniel P Connolly

Charles A Casey

A puncture-resistant glove includes a glove body having a hand portion with an index finger, a middle finger, a ring finger, a little finger and a thumb and a puncture-resistant area generally covering the hand portion, the thumb and the index finger.

Puncture-resistant glove

A current source generates, with high efficiency, a current that is substantially constant over a wide range of output voltages. This current is injected into the first end of a series-connected string of LEDs, with the second end of the string connected through a resistor to ground. The voltage developed across this resistor, which is a measure of current flow in the series string, is fed back to the current source, wherein feedback maintains nearly constant current output over a wide range of output voltages. A field effect transistor (FET) is placed in parallel with each LED in the string. A level shift gate driver couples a pulse width modulated control signal to the gate of each FET. With the FET being coupled across a particular LED, the LED can be bypassed when the FET is actuated or receive current when the FET is deactuated. By modulating the duty cycle of each FET, the brightness of each associated LED may be varied smoothly over its full range.

Highly efficient series string LED driver with individual LED control

In one embodiment, a power supply controller of a power supply system uses an algorithm to reduce the number of drive pulses to the output transistors under light load conditions. The algorithm groups the drive pulses to the output transistors into sets and removes some of the drive pulses for each set drive pulses issued by the controller. Each successive set removes additional drive pulses.

Low audible noise power supply controller and method therefor

A method for use with a direct metal bonding type process in which a metal layer is bonded to an insulating layer. The metal layer is applied to the insulating layer to enable a direct metal bond to be formed between the layers. The integrity of the bond between a portion of the layers is reduced by providing, prior to bonding, an interrupter between the portion of the layers. A structure in which a metal layer is directly metal bonded to an insulating layer and includes an interrupter between a portion of the metal layer and a portion of the insulating layer. The interrupter reduces the integrity of the bond between the portion of the metal layer and the portion of the insulating layer. The structure includes other features similar to those set forth with respect to the above described method.

Direct metal bonding

A package for electrical components in which a circuit board holds the components, includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space and are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal spaces. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to a circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.

Packaging electrical components

A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to the circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.

A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held in an internal-space between the circuit board and the upper internal surface. Conductive terminal pins extend from outside the enclosure into the internal space. The terminal pins are connected to the circuit board by conductive links, each link having an end attached to the periphery of the circuit board and another end projecting into the internal space. In other aspects, a resilient non-compressive encapsulant is used to fill a space within the package; an electronic component is mounted with a power-dissipating device sitting in the aperture of a circuit board, a power-dissipating surface in contact with a baseplate, and contact pads electrically connected to the circuit board; terminal pins are connected to a circuit board using a fence connected at the periphery of the circuit board, the fence extending substantially perpendicularly to the circuit board, the fence comprising at least two conductive links joined by a severable junction.

An electro-thermal isolating switch including an electrically driven, thermally isolated, heat generating semiconductor device; a thermally responsive element thermally connected with the semiconductor device; and contact means electrically isolated from the semiconductor device and electrically isolated from and driven by the thermally responsive element in accordance with heat generated by the semiconductor device.

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Concord, MA, United States of America

Brant T Johnson