Samtec Incorporated

Brandon Thomas Gore

Julian J Ferry

Yasuo Sasaki

Jonathan E Buck, Iii

Eric Jean Zbinden

Jignesh H Shah

John Coronati

Marc Epitaux

This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.

Ultra-dense, low-profile edge card connector

An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

Lossy material for improved signal integrity

Growing community of inventors

Lexington, SC, United States of America

Brandon Thomas Gore