Cooligy, Inc.

Liebert Corporation

Vertiv Corporation

Brandon R Leong

Douglas E Werner

Richard Grant Brewer

Norman Chow

James Hom

Mark McMaster

Adrian Correa

Tien-Chih Lin

Tien Chih (Eric) Lin

Gregory Shiomoto

Girish Upadhya

Sudhakar Gopalakrishnan

Madhav Datta

Hae-won Choi

Tien-Chieh (Eric) Lin

A pumped refrigerant cooling system having cooling units with associated pumping units for providing working fluid to the cooling unit to enable cooling of a space. The pumped refrigerant cooling system also includes a redundant pumping unit which is activated when a primary pumping unit associated with a cooling unit becomes inactive. The primary pumping unit is deactivated in favor of the redundant pumping unit. Once the primary pumping unit is placed in a condition suitable for reactivation, the redundant pumping unit is deactivated, and the primary pumping unit is reactivated.

Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy

A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes multiple heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes one or more swivel joints, each configured to provide one or more fluid paths between the cooling door and the frame. The cooling door assembly includes separate and independent fluid paths, where fluid is separately provided to each independent fluid path. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.

Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door

A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.

A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.

Microheat exchanger for laser diode cooling

The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

Internal access mechanism for a server rack

Growing community of inventors

Santa Clara, CA, United States of America

Brandon R Leong