Microsoft Technology Licensing, LLC

Brandon Earl Gary

Luke Thomas Gregory

Bo Dan

Chau Van Ho

Gary Russell McClary

Neeraj Ladkani

Jason David Adrian

Rameez Kadar Kazi

Christy Felix Pradeep Antony

Gary Russell Mcclary

A cooling system may include a first domain having a first fluid inlet and a first fluid outlet. A cooling system may include a second domain having a second fluid inlet and a second fluid outlet. A cooling system may include a thermal break between the first domain and the second domain. The thermal break includes a thermal gap separating the first domain and the second domain by 1 mm or less.

Devices, systems, and methods for a cooling system

A vapor chamber includes a main body, a first vertical structure, and an enhanced boiling surface. The main body has a first surface and defines a first portion of an interior volume. The first vertical structure protrudes transverse to the main body and defines a second portion of the interior volume. The enhanced boiling surface is on at least a portion of the first vertical structure.

Systems and methods for three-dimensional vapor chambers in immersion-cooled datacenters

In some aspects, the techniques described herein relate to a cooling system for a computing device. The cooling system includes an air-cooled cooling system located in a housing. The air-cooled cooling system includes a heat sink thermally connected to a processor, an air-cooling radiator, and a heat pipe connecting the heat sink to the air-cooling radiator. The cooling system includes a liquid-cooled cooling system located in the housing. The liquid-cooled cooling system includes a cold plate thermally connected to a to the heat sink, a pump, a fluid radiator, and a fluid piping system connecting the pump, the cold plate, and the fluid radiator.

Devices, systems, and methods for a hybrid cooling system

A thermal management device includes a heat spreader and a folded graphite sheet. The heat spreader is configured to receive heat from a heat source. The folded graphite sheet is connected to the heat spreader to receive and exhaust heat from the heat spreader. The folded graphite sheet includes a first fin, a second fin, and a segment connecting the first fin and second fin. The first fin is oriented at least partially vertically away from the heat spreader. The second fin is oriented at least partially vertically away from the heat spreader. The folded graphite sheet is continuous through the first fin, the segment, and the second fin.

Folded graphite fins for heatsinks

Cooling of an electronic device that includes a first portion and a second portion is provided. The first portion and the second portion are rotatable relative to each other. A first sensor measures a first temperature at a first location within or on the electronic device continuously or intermittently. A second sensor measures a second temperature at a second location within or on the electronic device continuously or intermittently. A processor identifies a first state of the electronic device or a second state of the electronic device. The processor controls operation of the electronic device based on the first measured temperature and the second measured temperature when the electronic device is in the identified first state and controls the operation of the electronic device based on the first measured temperatures but not based on the second measured temperatures when the electronic device is in the identified second state.

Device configuration-based thermal management control

The present concepts maintain forward flow and prevent reverse flow of heat-transferring media. A first zone and a second zone are proximate to each other. A first fan moves air through the first zone in a forward direction. A second fan moves air through the second zone in a forward direction. The speed of the first fan is compared with the speed of the second fan. If the first fan speed is slower than the second fan speed, then the first fan speed is adjusted to match the second fan speed. Therefore, reverse airflow in the first zone is prevented.

Reverse flow prevention

A heat sink may include a base having a first surface in a first plane configured to contact a system on chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include opposing internal walls that define a second spacing between the plurality of heat transfer members. The heat sink may include an enclosure surrounding the plurality of heat transfer members. The enclosure may include a base plate that contacts the base of the heat sink to form a cold-plate. The enclosure may partially surround the length of the heat transfer members, allowing airflow through the enclosure in a cross direction.

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