Intel Corporation

University of California

California Institute of Technology

University of Southern California

Brandon C Marin

Jeremy D Ecton

Srinivas V Pietambaram

Hiroki Tanaka

Kristof Darmawikarta

Tarek A Ibrahim

Suddhasattwa Nad

Dilan Seneviratne

Frank Truong

Yonggang Li

Aleksandar Aleksov

Leonel R Arana

Gang Duan

Praneeth Kumar Akkinepally

Omkar G Karhade

Shivasubramanian Balasubramanian

Sai Vadlamani

Whitney Michael Bryks

Haobo Chen

Ravindranath Vithal Mahajan

Robert Alan May

Nitin A Deshpande

Zhiguo Qian

Rahul Jain

Andrew James Brown

Xiaoqian Li

Bai Nie

Jason M Gamba

Sameer Paital

Darko Grujicic

Benjamin Duong

Matthew L Tingey

Debendra Mallik

Zhichao Zhang

Sri Ranga Sai Boyapati

Sheng C Li

Conor O'Keeffe

Xavier Francois Brun

Dingying David Xu

Marcel Arlan Wall

Hongxia Feng

Oscar Ojeda

Srinivas Venkata Ramanuja Pietambaram

Jieying Kong

Kaveh Hosseini

Divya Pratap

Kemal Aygün

Haifa Hariri

Bohan Shan

Mohammad Mamunur Rahman

Axel Scherer

Sujit Sharan

Georgios C Dogiamis

Bryan K Casper

Kemal Aygun

Rahul N Manepalli

James E Jaussi

Scott E Fraser

Pooya Tadayon

Kyu Oh Lee

Krishna Bharath

Mitul Bharat Modi

Yikang Deng

Sameer Walavalkar

Sri Chaitra Jyotsna Chavali

Mozhgan Mansuri

Siddharth K Alur

Prithwish Chatterjee

Ankur Agrawal

Changhua Liu

Xiaoying Guo

Bharat P Penmecha

Chieh-feng Chang

Karumbu Meyyappan

Arnab Sarkar

Tolga Acikalin

Hari Mahalingam

Rengarajan Shanmugam

Kenneth Brown

Roy Dittler

Suresh V Pothukuchi

Priyanka Dobriyal

Andrea R Tao

Hsin-Wei Wang

Vahidreza Parichehreh

Trina Ghosh Dastidar

Sarah Blythe

Numair Ahmed

Valery Ouvarov-Bancalero

Xiaoxuan Sun

Stephen Smith

Rajesh Inti

Sirisha Chava

Chelsea M Groves

Melissa Wette

Cary Kuliasha

Brent Williams

Mollie Stewart

Yiyang Zhou

Nathan Ou

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

High bandwidth optical interconnection architectures

Embodiments herein relate to systems, apparatuses, or processes directed to an integrated optical coupler that may be used to optically couple a waveguide and a PIC. In embodiments, the integrated optical coupler may include an optical diffraction grating mechanism, an optical lens, and a Faraday rotator. In embodiments, the integrated optical coupler may at least partially within a housing. Other embodiments may be described and/or claimed.

Integrated optical coupler

Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.

Faraday rotator interconnect as a through-via configuration in a patch architecture

Position controlled waveguides and methods of manufacturing the same are disclosed. An example apparatus includes a substrate with a channel that extends into a first surface of the substrate to a second surface of the substrate, wherein the second surface is recessed relative to the first surface; buffer material having a first index of refraction on the second surface of the substrate; and a waveguide on the buffer material, the waveguide having a second index of refraction that is higher than the first index of refraction.

Position controlled waveguides and methods of manufacturing the same

Microelectronic integrated circuit package structures include a first substrate coupled to a second substrate by a conductive interconnect structure and a dielectric material adjacent to the conductive interconnect structure. A cavity in a surface of the first substrate is adjacent to the conductive interconnect structure. A portion of the dielectric material is within the cavity.

Hybrid bonding technologies with thermal expansion compensation structures

An optoelectronic assembly is disclosed, comprising a substrate having a core comprised of glass, and a photonic integrated circuit (PIC) and an electronic IC (EIC) coupled to a first side of the substrate. The core comprises a waveguide with a first endpoint proximate to the first side and a second endpoint exposed on a second side of the substrate orthogonal to the first side. The first endpoint of the waveguide is on a third side of the core parallel to the first side of the substrate. The substrate further comprises an optical via aligned with the first endpoint, and the optical via extends between the first side and the third side. In various embodiments, the waveguide is of any shape that can be inscribed by a laser between the first endpoint and the second endpoint.

Nested glass packaging architecture for hybrid electrical and optical communication devices

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer; a redistribution layer (RDL) on the first layer, wherein the RDL includes conductive vias having a greater width towards a first surface of the RDL and a smaller width towards an opposing second surface of the RDL; wherein the first surface of the RDL is electrically coupled to the second surface of the first die by first solder interconnects having a first solder; and a second die in a second layer on the RDL, wherein the second die is electrically coupled to the RDL by second solder interconnects having a second solder, wherein the second solder is different than the first solder.

Microelectronic assemblies including interconnects with different solder materials

Methods and apparatus to increase glass core thickness are disclosed. An example apparatus includes a first glass substrate, a second glass substrate, an interface layer between the first glass substrate and the second glass substrate, the interface layer coupling the first glass substrate to the second glass substrate, and an interconnect extending through at least a portion of the first glass substrate and at least a portion of the second glass substrate.

Methods and apparatus to increase glass core thickness

Embodiments disclosed herein include electronic packages with embedded inductors and methods of forming such electronic packages. In an embodiment, the electronic package comprises a package core, and a plated through hole (PTH) through a thickness of the package core. In an embodiment, the electronic package further and a magnetic shell around a perimeter of the PTH, where a height of the magnetic shell is less than the thickness of the package core. In an embodiment, the magnetic shell comprises a substantially vertical sidewall and a bottom surface that is tapered.

Stepped coax MIL PTHS for modulating inductance within a package

Embodiments disclosed herein include photonics systems with a dual polarization module. In an embodiment, a photonics patch comprises a patch substrate, and a photonics die over a first surface of the patch substrate. In an embodiment, a multiplexer is over a second surface of the patch substrate. In an embodiment, a first optical path from the photonics die to the multiplexer is provided for propagating a first optical signal, and a second optical path from the photonics die to the multiplexer is provided for propagating a second optical signal. In an embodiment, a Faraday rotator is provided along the second optical path to convert the second optical signal from a first mode to a second mode before reaching the multiplexer.

Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packages

An electro-optical system having one or more electro-optical devices integrally formed within a substrate and associated methods are disclosed. An electro-optical system including an electro-optic switch is shown. An electro-optical system including an electro-optic modulator is shown. An electro-optical system including an optical resonator is shown.

Glass interposer optical switching device and method

An integrated circuit (IC) package substrate, comprising a magnetic material embedded within a dielectric material. A first surface of the dielectric material is below the magnetic material, and a second surface of the dielectric material, opposite the first surface, is over the magnetic material. A metallization level comprising a first metal feature is embedded within the magnetic material. A second metal feature is at an interface of the magnetic material and the dielectric material. The second metal feature has a first sidewall in contact with the dielectric material and a second sidewall in contact with the magnetic material.

In-plane inductors in IC packages

An electronic substrate may be fabricated having a core comprising a laminate including a metal layer between a first insulator layer and a second insulator layer, a metal via through the core, and metallization features on a first side and a second side of the core, wherein first ones of the metallization features are embedded within dielectric material on the first side of the core, and wherein a sidewall of the dielectric material and of the first insulator layer defines a recess over an area of the metal layer. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board. Other embodiments are disclosed and claimed.

Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity

Integrated circuit packages may be formed having at least one optical via extending from a first surface of a package substrate to an opposing second surface of the package substrate. The at least one optical via creates an optical link between the opposing surfaces of the package substrate that enables the fabrication of a dual-sided optical multiple chip package, wherein integrated circuit devices can be attached to both surfaces of the package substrate for increased package density.

Through-substrate optical vias

Glass interposer optical resonator device and method

Growing community of inventors

Chandler, AZ, United States of America

Brandon C Marin