Intel Corporation

Other

Brandon Barnett

Gordon D Holt

Bruce A Block

Ian A Young

Hernan Adolfo Castro

Thomas P Thomas

Johanna M Swan

Wei W Wang

Valery M Dubin

Manish Chandhok

Florian Gstrein

Kishore K Chakravorty

Handong Li

Paul Davids

Joseph F Ahadian

Narayan Sundararajan

Ghadeer Antanius

Miriam Ruth Reshotko

Xiao-Feng Qi

Warren Morrow

Narayanan Sundararajan

Richard Wykoff

Sorin Davidovici

Douglas N Stunkard

A wafer having a plurality of dies (also called array chips) on the wafer, the die having an electrode to generate a deprotecting reagent, a working electrode to electrochemically synthesize a material, a confinement electrode adjacent to the working electrode to confine reactive reagents, and a die pad, wherein die pads of the plurality of dies are interconnected on the wafer to electrochemically synthesize the material in parallel on a plurality of working electrodes is disclosed. Also, a method for wafer-scale manufacturing of a plurality of dies and a method for electrochemically synthesizing a material in parallel on a plurality of dies on a wafer are disclosed.

Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesis

Described are devices and methods for detecting the match quality and concentration of analytes binding to an electrode surface. The devices utilize a clock to measure capacitance change as a function of time and a temperature controller to measure the capacitance change as a function of temperature.

Method and apparatus for match quality analysis of analyte binding

Described are devices and methods for detecting binding on an electrode surface. In addition, devices and methods for electrochemically synthesizing polymers and devices and methods for synthesizing and detecting binding to the polymer on a common integrated device surface are described.

Method and apparatus for combined electrochemical synthesis and detection of analytes

Described are quality control methods and devices for the reproducible manufacturing and integrity monitoring of polymers on electrochemical synthesis and detection chips. The devices and methods allow for simultaneous manufacturing and synthesis of polymers.

Quality control methods for the manufacture of polymer arrays

A microchip includes optical layers with integrated waveguides and modulators. A continuous wave light beam coupled to incoming waveguide(s) is modulated and transmitted off-chip by outgoing waveguides coupled to optical interconnects.

Optical interconnect system for high speed microprocessor input/output (IO)

An integrated optoelectrical package for optoelectrical integrated circuits (ICs) is disclosed. The package includes a package substrate having contact receiving members on an upper surface. The contact receiving members are electrically connected to contacts on the lower surface. An optoelectronic receiver package and an optoelectronic transmitter package are each electrically mounted to respective first and second subsets of the contact receiving members. Input and output waveguide arrays are formed atop the substrate package and are optically coupled to the optoelectronic receiver package and the optoelectronic transmitter package, respectively. The contacts on the lower surface of the package substrate are designed to contact and engage the contact receiving members of a standard printed circuit board (PCB).

Optoelectrical package

A monitoring device having a signal receiver, a pseudo-ground, a digital processor and a transceiver, the signal receiver having an ability to receive a sensed signal representing a patient vital sign, the pseudo-ground having an ability to generate a baseline signal that is compared with the sensed signal, the transceiver having an ability to wirelessly transmit a processed signal from the digital processor to a base station or a wireless gateway and to receive an incoming signal from the base station or the wireless gateway, and the digital processor having an ability to process the sensed signal and the incoming signal locally within the monitoring device is disclosed.

Wireless medical sensor system

An optical bus interconnects two or more processors in a multiprocessor system. One or more electrical-to-optical ('E-O') transmitters are optically coupled to the optical bus using optical couplers. The E-O transmitters receive electrical signals from the processors and convert the electrical signals to optical signals to be guided onto the optical bus. Optical-to-electrical ('O-E') receivers are also coupled to the optical bus using the optical couplers. The O-E receivers receive optical signals from the optical bus and convert the optical signals to electrical signals for the processors.

Optical add/drop interconnect bus for multiprocessor architecture

A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.

Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board

A microchip may include an optical clocking system. The optical clocking system may include a ring resonator which multiplies the frequency of light pulses from a light source for use as optical clocking signals and distribution waveguides to distribute the optical clocking signals to different regions of the microchip.

Growing community of inventors

Beaverton, OR, United States of America

Brandon Barnett