General Electric Company

Brady Andrew Jones

Milivoj Konstantin Brun

Robert Stephen Lewandowski

Joseph Edward Piel, Jr

A combined acoustic backing and interconnect module for connecting an array of ultrasonic transducer elements to a multiplicity of conductors of a cable utilizes the backing layer volume to extend a high density of interconnections perpendicular to the transducer array surface. The module is made by injecting flowable backfill material into a mold made up of a plurality of spacer plates having aligned channels, with interleaved flexible circuit boards. The backfill material is cured to form a backing layer which supports the flexible circuit boards in mutually parallel relationship. Excess flexible circuit material on one side of the backing layer is cut flush with the front face of the backing layer, leaving exposed ends of the conductive traces on the flexible circuit boards. The module is then laminated to a piezoelectric ceramic layer, and diced. The flexible circuit board conductive traces are aligned with, and electrically connected to, signal electrodes of the transducer elements. The other ends of the conductive traces on a fanout portion of the flexible circuit board are connected to the cable.

Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array

A ceramic composite is produced wherein the matrix is comprised of silicon nitride and cordierite and the reinforcing phase is comprised of Si-C-containing fibers.

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Sunset Beach, NC, United States of America

Brady Andrew Jones