Raytheon Company

Bradly Eachus

Edward P Smith

Jonathan Getty

David Brehl

Jamal I Mustafa

Michael J Batinica

A method of forming an image detector from an optical detector having a first side connected to a substrate and a second side opposite the first side. The method includes: receiving the detector; electrically coupling the second side of the detector to a read out integrated circuit (ROIC); securing the detector to the ROIC with an adhesive, wherein the adhesive surrounds the detector and at least a portion of the substrate. The method also includes chemically removing at least some of the substrate to expose an exposed portion of the first side of the detector. Such removal results in the formation of an adhesive fence from the adhesive that has a fence upper surface that is above the first side on which an optical element is mounted such that an air gap exists between the first side of the detector and the optical element.

Optical device having a detector and an optical element mounted on an epoxy fence

A photo detector having a substrate and a first structure formed on the substrate. The first structure includes an emitter layer formed on the substrate and a base layer formed on the emitter layer. Further, the first structure includes a collector layer formed on the base layer. The collector layer has a plasmonic structure. The plasmonic structure includes a first plurality of mesa structures. Each of the mesa structures of the first plurality of mesa structures includes a second plurality of mesa structures having ridges arranged in a regularly repeating pattern.

Infrared photodetector architectures for high temperature operations

A unit cell of a focal plane array (FPA) is provided. The unit cell includes a first layer having a first absorption coefficient. The first layer is configured to: sense a first portion of a polarized light of an incident light having a first portion and a second portion, convert the first sensed portion of incident light into a first electrical signal, and pass through a second portion of the incident light. Further, the unit cell includes a second layer having a second absorption coefficient and positioned adjacent to the first layer and configured to receive the second portion of the incident light. The second layer is configured to convert the second portion of the incident light to a second electrical signal. Also, the unit cell includes a readout integrated circuit positioned adjacent to the second layer and configured to receive the first electrical signal and the second electrical signal.

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Buellton, CA, United States of America

Bradly Eachus