Raytheon Company

Bradley O Hansen

Michael R Beylor

Kevin W Patrick

Jeremy Bart Baldwin

Michael D Gordon

Lloyd Cox

Daniel R Bruns

A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.

Stacked filters

Embodiments of digital high-speed bi-phase modulator and method for bi-phase modulation are generally described herein. In some embodiments, the digital high-speed bi-phase modulator comprises a high-speed digital divider, a high-speed digital multiplexer, and matched signal paths provided between the divider and the multiplexer. The high-speed digital divider is configured to receive a carrier signal and generate complementary output signals. The high-speed digital multiplexer is configured to switch between the complementary output signals and generate a bi-phase modulated output at a carrier frequency (f) modulated with a bi-phase code. The bi-phase code may be provided to control inputs of the multiplexer.

High-frequency, high-speed precision digital bi-phase modulator and method for bi-phase modulation

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Vail, AZ, United States of America

Bradley O Hansen