Texas Instruments Corporation

Amkor Technology, Inc.

Bradley Morgan Haskett

John Patrick O'Connor

Wei-Yan Shih

Jwei Wien Liu

Mark Myron Miller

Steven Monroe Penn

Sean Timothy Crowley

Steven Edward Smith

Edward Carl Fisher

Frank Odell Armstrong

Ivan Kmecko

Daniel C Estabrook

Mark Phillip Popovich

Terry Alan Bartlett

Jeffrey Alan Miks

William Robert Morrison

Jane Qian Liu

Jeffrey E Faris

Vincent C Lopes

Jeffery Alan Miks

Braden Peter D'Andrea

Jeffrey E Farris

An example includes: a substrate having a first package surface, having a second package surface opposite the first package surface, and having a die cavity with a depth extending into the first package surface; a semiconductor die having bond pads on a first die surface and having a second die surface opposite the first die surface, the semiconductor die having a die thickness, the second die surface of the semiconductor die mounted in the die cavity; a cover over a portion of the first die surface; conductors coupling the bond pads of the semiconductor die to bond fingers on the first package surface of the substrate; and dielectric material over the conductors, the bond fingers, the bond pads, at least a portion of the first semiconductor die and at least a portion of the cover, wherein the dielectric material extends above the first package surface of the substrate.

Semiconductor device package with die cavity substrate

An example ceramic panel has a first surface and a second surface. The ceramic panel has a bond finger well on the first surface of the ceramic panel a scribe line well on the second surface of the ceramic panel. The ceramic panel also has a scribe line along the scribe line well.

Substrate processing and packaging

Disclosed embodiments demonstrate batch processing methods for producing optical windows for microdevices. The windows protect the active elements of the microdevice from contaminants, while allowing light to pass into and out of the hermetically sealed microdevice package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale.

Low cost window production for hermetically sealed optical packages

A piezoelectric device is disclosed which has a built-in soft stop which serves for protection against excessive force.

Soft mechanical stops to limit over-travel of proof masses in cantilevered piezoelectric devices

According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

Micro-optical device packaging system

A package frame for use in packaging microelectromechanical devices and/or spatial light modulators comprises a frame, a stiffener, and a heat dissipater.

Package stiffener and a packaged device using the same

Disclosed embodiments demonstrate batch processing methods for producing optical windows for micro-devices. The windows protect the active elements of the micro-device from contaminants, while allowing light to pass into and out of the hermetically sealed micro-device package. Windows may be batch produced, reducing the cost of production, by fusing multiple metal frames to a single sheet of glass. In order to allow windows to be welded atop packages, disclosed embodiments keep a lip of metal without any glass after the metal frames are fused to the sheet of glass. Several techniques may accomplish this goal, including grinding grooves in the glass to provide a gap that prevents fusion of the glass to the metal frames along the outside edges in order to form a lip. The disclosed batch processing techniques may allow for more efficient window production, taking advantage of the economy of scale.

A light valve assembly comprises a holographic optical element and a light valve that comprises an array of individually addressable pixels. The light valve assemblies can be fabricated on the die level or on a wafer-level.

Light valve assembly with a holographic optical element and a method of making the same

Microdisplay assemblies, methods of packaging microdisplays, and methods of testing microdisplays are disclosed. In accordance with one embodiment, a microdisplay assembly includes a support and a microdisplay disposed on the support. The microdisplay includes a semiconductor workpiece mounted to the support and an optical device region disposed over the semiconductor workpiece. A plurality of contacts is disposed over a portion of the semiconductor workpiece, wherein each of the plurality of contacts comprises a protruding feature.

Microdisplay assemblies and methods of packaging microdisplays

An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.

Method and apparatus for forming a DMD window frame with molded glass

A system for testing a lighting diode includes one or more nozzles, a probe, and a detector, where the lighting diode is operable to emit light in response to a current. The one or more nozzles direct a cooling fluid towards the lighting diode. The probe applies a current to the lighting diode. The detector detects the light emitted by the lighting diode in response to the current.

System and method for testing a lighting diode

An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a 'U' shape, an inverted 'U' shape, a curved step shape, or other combinations thereof.

Stress relieved flat frame for DMD window

In one embodiment, a laser module comprising an optical element, a frequency converter, a selective reflector, and one or more surface-emitters, each coupled to a common substrate, wherein the emitters, the optical element, the frequency converter, and the selective reflector are positioned with respect to each other such that at least a portion of the coherent light emitted from the surface-emitters travels through the optical element, through the frequency converter and through the selective reflector. In a method embodiment, a method for frequency converting light generated by a surface-emitter, wherein the light passes through an optical element, a frequency converter, and a selective reflector, each coupled to a common substrate.

Growing community of inventors

Allen, TX, United States of America

Bradley Morgan Haskett