Ferro Corporation

Bradley M Kraft

Eric Oswald

Sean Frink

Brian Santora

The present invention provides an aqueous CMP slurry composition that includes abrasive particles and from about 0.01% to the limit of solubility in water of a compound according to Formula (I): wherein only one of R, R, R, Rand Ris a hydroxyl group (&#x2014;OH), only one of R, R, R, Rand Ris a methoxy group (&#x2014;OCH), and the three of R, R, R, Rand Rthat are not either a hydroxyl group (&#x2014;OH) or a methoxy group (&#x2014;OCH) are hydrogen atoms (&#x2014;H).

Chemical-mechanical polishing compositions and methods of making and using the same

The present invention provides auto-stopping CMP slurry compositions that minimize post-CMP non-uniformity and also extend the time that polishing can be continued beyond the end point without the risk of over-polishing the dielectric silicon dioxide film. Auto-stopping CMP slurry compositions according to the invention include ceria abrasive particles and an effective amount of a polyalkylamine such as polyethyleneimine dispersed in water. The methods of the invention include polishing a topographic dielectric silicon dioxide film layer using the auto-stopping CMP slurry compositions to obtain a dielectric silicon dioxide surface having a desired predetermined minimum step height.

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Fairport, NY, United States of America

Bradley M Kraft