Xerox Corporation

Bradley James Gerner

John Richard Andrews

Bryan R Dolan

Pinyen Lin

Peter Johan Nystrom

Chad Johan Slenes

Antonio DeCrescentis

Jonathan Robert Brick

Richard Schmachtenberg, Iii

Samuel Vincent Schultz

Andrew Wayne Hays

Terrance Lee Stephens

Kock-Yee Law

David Joseph Gervasi

Peter M Gulvin

Gerald A Domoto

Mark Anthony Cellura

Robert P Siegel

James Maxwell Stevenson

Hong Zhao

David Paul Platt

Jun Ma

Dan Leo Massopust

Antonio L Williams

Stephen C O'Leyar

Jim Stevenson

An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

Laser welded bonding pads for piezoelectric print heads

An actuator assembly including a flexible printed circuit and a method for making such an actuator assembly are provided. The flexible printed circuit includes a body having a top side and a bottom side, with the body defining a plurality of bumps extending from the bottom side. A first bump of the plurality of bumps is disposed adjacent to a second bump of the plurality of bumps, and the body further defines at least one relief configured to reduce movement of the second bump caused by movement of the first bump. The flexible printed circuit also includes a plurality of contact pads disposed on the bottom side of the body at least partially at the plurality of bumps, with the plurality of contacts pads being configured to be electrically coupled to a power source and to a piezoelectric transducer.

Reduced mechanical coupling with structured flex circuits

A printhead for an ink jet printer can be formed as a plurality of substructures which are connected subsequent to inspection and/or testing. A substructure can include a semiconductor substrate such as a silicon substrate having a plurality of heater traces which are used to maintain a temperature of melted solid ink within a tolerance of a desired temperature. The traces can be accurately formed using semiconductor processing techniques. Testing and/or inspecting the substructures prior to assembly can reduce rework and scrap, and can allow the formation of printhead structures from a wide variety of materials.

Patterned heater traces for inkjet printhead

A structure and method including a filter assembly, wherein the structure can be an ink jet printhead including the filter assembly. The filter assembly can include a first filter layer having a plurality of pores therein, wherein the pores have a first pitch, and a second filter layer having a plurality of pores therein, wherein the pores in the second filter layer have a second pitch which is different than the first pitch. The structure can include a fluid path through the filter assembly. An area of overlap of the pores in the first filter layer with the pores in the second filter layer, in a vertical direction perpendicular to a plane of the filter assembly, can include a periodicity.

Multiple layer filter

Apparatus and methods for heating a printer jet stack. The apparatus includes a first layer and a second layer disposed generally parallel to the first layer. The apparatus also includes a heating layer including a thermal epoxy configured to generate heat when an electrical current is applied thereto. The heating layer is disposed between and bonds together the first layer and the second layer.

Screen printed jet stack heater

An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Method of making an electrical circuit structure

An electronic device has an electronic signal source electrically connected to a signal routing circuit, an electrically activated transducer to receive electronic signals through the signal routing circuit, and an anisotropic conductive film to provide electrical continuity between the signal routing circuit and the transducer, the anisotropic conductive film having material removed adjacent the transducer to reduce mechanical loading of the transducer.

Transducer interconnect with conductive films

A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, electrically coupling a plurality of conductive elements to the plurality of piezoelectric elements, and curing the interstitial layer. A plurality of electrically isolated conductive particles within the interstitial layer electrically couple the plurality of conductive elements to the plurality of piezoelectric elements. The conductive particles can be evenly distributed throughout the totality of the interstitial layer dielectric, or they can be localized over a top surface of each piezoelectric element and interposed between the plurality of piezoelectric elements and the plurality of conductive elements. The conductive elements can be part of a flex circuit or printed circuit board.

Patterned conductive array and self leveling epoxy

A manifold assembly has been constructed that filters ink before the ink enters an inkjet ejector in an inkjet print head. The manifold assembly includes an adhesive layer having openings, an ink manifold layer having a plurality of openings, the openings in the adhesive layer being aligned with the openings in the ink manifold layer, and a polymer layer having a plurality of filter areas, the filter areas being aligned with the openings in the ink manifold layer and the openings in the adhesive layer, the adhesive layer being interposed between the polymer layer and the ink manifold layer.

Inkjet ejector having an improved filter

An aperture plate for a print head of a printer can include a first layer having a first emissivity which is covered by a second layer having a second emissivity which is less than the first emissivity. In an embodiment, the second layer can be etched at nozzle locations to form openings in the second layer which have widths/areas greater than widths/areas of nozzles formed in the first layer. In another embodiment, the second layer can have a smaller thickness at the nozzle locations and a larger thickness away from the nozzle locations. Forming the openings in the second layer which are larger than the nozzles, or forming the second layer thinner at the nozzle locations prior to forming the nozzles, can provide a well-formed nozzle and an aperture plate having a low emissivity.

Patterned metallization on polyimide aperture plate for laser-ablated nozzel

A method for assembling an inkjet jet print head enables piezoelectric transducers to be bonded to an inkjet ejector without closing inlets to a pressure chamber within the inkjet ejector. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer with a thermoset adhesive, placing thermoset polymer in areas between the piezoelectric transducers on the diaphragm layer, and drilling inlets through the thermoset polymer and the diaphragm at the openings in the diaphragm.

Method for facilitating assembly of a printhead having a polymer layer

A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing a dielectric fill layer over the diaphragm and the plurality of piezoelectric elements to encapsulate the piezoelectric elements, curing the dielectric fill layer to form an interstitial layer, then removing the interstitial layer from an upper surface of the plurality of piezoelectric elements using a plasma etch.

Polymer layer removal on pzt arrays using a plasma etch

A method for mounting a piezoelectric transducer layer to a diaphragm layer exposes an electrode for each piezoelectric transducer after thermoset polymer filling the interstitial space between the piezoelectric transducers has been cured. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer, filling areas between the piezoelectric transducers on the diaphragm layer with thermoset polymer, and removing the thermoset polymer from the piezoelectric transducers with a laser to expose a metal electrode on each piezoelectric transducer.

Growing community of inventors

Penfield, NY, United States of America

Bradley James Gerner