Amazon Technologies, Inc.

Bradley David Urban

Dominic Timothy Shiosaki

Ricky Dean Welsh

Christopher Lorenzo Dunn

Christopher John Kraeutle

Jon T Braam

Aviv Shoval

Robert Olson

Ryan Michael Fleming

Rahul Bhardwaj

Kyle Thomas Miller

Gaurav Soni

Raffaele Cipolletta

Isabella Talley Lewis

Troy Hulick

Matthew Michael Seflic

Vaughn Todd Arnold

Ramez Nachman

Albert John Yu Sam Chua

David B Townsley

Shelomon Patrick Doblack

John Frederick Larkin

Mohammed Aftab Alam

Marcus-Alan Gilbert

Kenneth James Albanowski

Kok Yen Cheng

Bryan Dan Trinh

William James Carter-Giannini

Manuel Rosendo Arana Manzano

Srivatsan Subbarayan

Adam Kenneth Cybart

Gregory James Nyssen

Robi Thomas

James Nelson Aldrich

Michael Paul Nelson

Eduardo Bezerra Valentin

Alexander Hu

Cameron Bo Logsdon

Guruprasad Ramanathan

Christopher Michael Buonomo

Daniel Jones

Nagesh Rao Janapala

David Joseph Derrick

David Tang

William Franklin Troutman, Jr

An airframe design may include a bonded frame or assembly, and one or more components that may be removably attached to the bonded frame. The bonded frame may include struts, central bulkheads, a tail section, a plurality of wing sections, and motor mounts that are adhered together using adhesive. The one or more attachable components may include a forward fuselage, motors, propellers, motor pod fairings, stabilizer fins, and landing gear that are attached using fasteners. The bonded frame may reduce the number of parts of the airframe design and may also reduce complexity, cost, and weight, while also increasing stiffness and strength. Further, the various attachable components may facilitate fabrication, assembly, and maintenance of an aerial vehicle having the airframe design.

Aerial vehicle airframe design and manufacturing

Aerial vehicles may be equipped with propellers having pivotable blades that are configured to rotate or fold when the propellers are not rotating under power. A pivotable blade may rotate about an axis of a propeller with respect to a hub in the presence of wind flow until the pivotable blade is coaligned with a fixed blade, in a direction opposite to the wind flow. A pivotable blade may also fold over a hub of a propeller in the presence of wind flow, with the pivotable blade and a fixed blade being oriented in directions opposite to the wind flow. A center of mass of the pivotable blade may be caused to be on the same side of an axis as a center of mass of a fixed blade, even where the axis is not normal to the wind flow, thereby reducing an amount of drag generated by the propeller.

Independently rotatable propeller blade mounts

Shaft-mounted operators for folding and opening propeller blades

Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.

Unibody thermal enclosure

Determining an in-plane thermal conductivity of anisotropic materials, such as display stacks, printed circuit boards (PCBs), and composite housings, includes heating a first region of an anisotropic sample, cooling a second region of the sample, and measuring temperature at a first location between the first region and the second region and a second location between the first region and the second region. The in-plane thermal conductivity of the sample is computed based at least in part on the temperature at the first location, the temperature at the second location, the distance from the first region to the second region, a thickness of the substantially planar anisotropic substrate, and an amount of heat applied to the first region.

Thermal conductivity measurement of anisotropic substrates

Various examples are directed to providing thermal management to a computing device. The computing device may receive temperature state data describing a temperature state of the computing device. The temperature state may comprise a first temperature value at a first location at the computing device. The computing device may also receive use state data describing a first use state of the computing device. The first use state may comprise an initial operating condition of a first component of the computing device and an initial operating condition of a second component of the computing device. The computing device may determine that at least one temperature value at the computing device is out-of-range and select a second use state for the computing device. The second use state may comprise at least one of a new operating condition for the first component or a new operating condition of the second component.

System level thermal management

An example enclosure includes a base, a plurality of walls extending from the base, and a top disposed opposite the base and connected to at least one of the plurality of walls. The enclosure also includes a light assembly configured to illuminate an interior space of the enclosure. The light assembly includes a diffuser, a heat sink connected to the diffuser, a substrate connected to the heat sink, and a light source connected to the substrate. The diffuser may be connected to one of the top or the base such that the heat sink is spaced from the one of the top or the base. Additionally, the top is moveable toward the base to transition the enclosure from an expanded state to a collapsed state.

Collapsible photo enclosure and components

An electronic device includes an elongated tubular housing. One or more electronic components are coupled to a chassis disposed in a cavity of the tubular housing. A pair of elongated channels are positioned on opposite sides of the chassis and between the chassis and a sidewall of the tubular housing. The channels are tapered or wedge-shaped along their lengths. During assembly, one of the channels may be slid longitudinally along the other, causing the channels to expand laterally, due to their wedge shape, to secure the chassis in the tubular housing. The chassis and the pair of channels provide a thermally conductive path to dissipate heat. During use, heat generated by the electronic components is transmitted radially outward from the electronic components, through the chassis and the pair of channels, and through the tubular housing to the exterior of the portable electronic device.

Electronic device with efficient thermal dissipation

Each of one or more temperature sensors of a computing system can measure and provide a temperature value (e.g., provide temperature data) to the system. In some embodiments, the system can apply an offset value, a time-based filter, and a weighting factor to each temperature value received from the one or more temperature sensors of the system. Based, at least in part, on the offsetting, filtering, and/or weighting, the computing system can determine (e.g., calculate, estimate, predict, etc.,) a temperature value representative of an enclosure temperature of the system. In some embodiments, based on the determined temperature value that is representative of the enclosure temperature, the computing system can perform appropriate subsequent processing in accordance with thermal management of the system.

Determining temperature using multiple sensors

A computing device and method including a thermal sensor positioned on a flexible circuit located in close proximity to the device enclosure or hot-spot to most accurately track and control skin temperature of the electronic device. One or more flexible circuits may be implemented to include one or more low profile temperature sensors specifically located to detect temperature in close proximity to the enclosure and/or components of interest or hot spots which may be more accurately monitored by locating the low profile temperature sensor on the flexible circuit within the enclosure without substantially increasing the z-height of the existing flexible circuits or taking up additional room within the enclosure.

Temperature sensor in flex circuit

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Cupertino, CA, United States of America

Bradley David Urban