Lockheed Martin Corporation

Bradley David Dufour

Eric L Holzman

Michael K McNulty

Richard Joseph Teti

Stephen Charles Miller

A hermetically sealed housing (10) includes a dielectric end portion (118) which provides a transmission-line feedthrough between a printed-circuit such as HDI and exterior connections. A first transmission line (1) on the PC board (30) transitions to a 3-via transmission line (4), which transitions to a third coplanar, microstrip, or stripline transmission line (3). The third transmission line (3) transitions to a second 3-via transmission line (5), which ends at a coplanar transmission line (2) which is outside the housing.

Hermetic feedthrough using three-via transmission lines

A hermetically sealed housing for plural GaAs chips includes a body made from Al/SiC. The body defines a peripheral seal ring support surface, an electrical connector insert support surface and an end wall to which a ceramic insert is mounted. The insert includes a first portion with an upper surface within the sealed housing, Which upper surface is coplanar with the upper surface of the body, for convenient HDI film connections to the chips and electrical connector inserts. The refractory electrical conductors extend from the upper surface of the first portion of the insert to an exterior terminal portion of the insert. The terminal portion of the insert is spaced from the first portion of the insert by a non-terminal portion containing no terminals. The non-terminal portion of the insert is coplanar with the seal ring support surface of the body, and contiguous therewith. The insert, a titanium seal ring, and the body are hermetically joined by aluminum, which fills the pores of the body and the interstices between the body, the insert, and the seal ring. A domed lid is sealed to the seal ring.

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Philadelphia, PA, United States of America

Bradley David Dufour