Hewlett-packard Development Company, L.P.

Bradley Bower

Charles Craig Haluzak

Quan Qi

Don Michael

Mari J Rossman

John Kane

Kevin E Swier

John R Sterner

Kirby Sand

John W Lee

Jimmy Perez

John R Stemer

A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.

Package for a micro-electro mechanical device

Various embodiments and methods are disclosed relating to one or more media guides configured to guide a surface being printed upon relative to a manually moved print device.

Media guide

A method of delivering fluid can include using electro-wetting effects to pick-up, transport, and/or deliver discrete volumes of fluid. Voltage can be applied across a fluid contact area having a conductive substrate and a dielectric material with an outer surface. The outer surface can have a native interfacial surface tension state and a voltage induced second state having a reduction in interfacial surface tension. A fluid can be contacted such that a volume of fluid adheres to the outer surface of the fluid contact area when the voltage is applied. Subsequently, the voltage can be adjusted such that at least a portion of the volume of fluid is delivered to a receiving location.

Electro-wetting on dielectric for pin-style fluid delivery

A fluid filling system includes a vacuum filling chamber configured to receive a wafer, a conduit coupled to the vacuum filling chamber, and a vacuum pump fluidly coupled to the vacuum filling chamber through the conduit, the vacuum pump being configured to create a vacuum within the wafer level packaging cavity, wherein the vacuum filling chamber includes a body having a vacuum orifice, a first substrate sealingly coupled to the body to seal a first end of the vacuum orifice, and a second substrate sealingly coupled to the body to seal a second end of the vacuum orifice.

System and a method for fluid filling wafer level packages

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Junction City, OR, United States of America

Bradley Bower