Atl Technology, LLC

Bradford James Brown

John Carl Holloway

Donovan M Finnestad

An electrical device that includes a ball grid array (BGA) component, comprising signal processing circuitry, a component mounting surface, and a BGA, which has solder balls that are spaced apart from each other on the component mounting surface. The electrical device also includes a plurality of electrical wires, each electrically coupled directly to a corresponding one of the solder balls of the BGA component. The electrical device further includes a wire fixation element, through which the plurality of electrical wires at least partially pass through. The wire fixation element is coupled to the plurality of electrical wires and configured to fix the electrical wires relative to each other so that the electrical wires do not move relative to each other.

Direct wire attachment methods and apparatus for a BGA component

An electrical device that comprises a printed circuit board, which has a first mounting surface, a second mounting surface, a mounting edge, and a plurality of mounting pads on the first mounting surface and the second mounting surface, and an electrical component that has a ball grid array. The electrical device further comprises an adaptor, interposed between the mounting edge and the electrical component, and comprising a body, made of an electrically non-conductive material, and a plurality of electrical pins, made of an electrically conductive material and passing at least partially through the body of the adaptor. The first end of each one of the plurality of electrical pins is electrically directly mounted to a corresponding one of the spaced apart solder balls. The second end of each one of the plurality of electrical pins is electrically directly mounted to a corresponding one of the plurality of mounting pads.

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Highland, UT, United States of America

Bradford James Brown