Advanced Semiconductor Engineering, Inc.

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Kay Stefan Essig

Mark Gerber

Jean Marc Yannou

Rich Rice

A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a conductive base, a first semiconductor die, a first conductive pillar, and a first encapsulant. The conductive base has a first surface. The first semiconductor die is disposed on the first surface of the conductive base. The first conductive pillar is disposed on the first semiconductor die. The first encapsulant is disposed on the first surface of the conductive base. The first encapsulant encapsulates the first semiconductor die. The first encapsulant includes an opening defined by the first conductive pillar.

Semiconductor package structure and method for manufacturing the same

A semiconductor package structure includes a substrate, a first semiconductor device, a first encapsulant and a second encapsulant. The substrate has a first coefficient of thermal expansion CTE. The first semiconductor device is disposed adjacent to a first surface of the substrate. The first encapsulant is disposed on the first surface of the substrate, and covers at least a portion of the first semiconductor device. The first encapsulant has a second coefficient of thermal expansion CTE. The second encapsulant is disposed on a second surface of the substrate and has a third coefficient of thermal expansion CTE. A difference between CTEand CTEis substantially equal to a difference between CTEand CTE

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Paris, France

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