Fei Comapny

Intel Corporation

Brad Larson

Brian Routh, Jr

Aditee Shrotre

Thomas Gary Miller

Richard J Young

John J Flanagan

John F Flanagan, Iv

James A McCall

Michael W Leddige

Pavel Potocek

Maurice Peemen

Remco Geurts

Oleg Sidorov

Ajit Deosthali

Thomas Miller

Methods and systems for implementing artificial intelligence enabled metrology are disclosed. An example method includes segmenting a first image of structure into one or more classes to form an at least partially segmented image, associating at least one class of the at least partially segmented image with a second image, and performing metrology on the second image based on the association with at least one class of the at least partially segmented image.

Artificial intelligence enabled metrology

Methods and systems for implementing artificial intelligence enabled preparation end-pointing are disclosed. An example method at least includes obtaining an image of a surface of a sample, the sample including a plurality of features, analyzing the image to determine whether an end point has been reached, the end point based on a feature of interest out of the plurality of features observable in the image, and based on the end point not being reached, removing a layer of material from the surface of the sample.

Artificial intelligence-enabled preparation end-pointing

Methods and apparatuses are disclosed herein for parameter estimation for metrology. An example method at least includes optimizing, using a parameter estimation network, a parameter set to fit a feature in an image based on one or more models of the feature, the parameter set defining the one or more models, and providing metrology data of the feature in the image based on the optimized parameter set.

Parameter estimation for metrology of features in an image

Apparatuses and methods directed toward endpoint detection are disclosed herein. An example method at least includes forming a plurality of lines on a top surface of a sample; removing, a plurality of times, material from a working surface of the sample, the working surface different than the top surface; imaging, a plurality of times, the sample to at least capture the plurality of lines; and determining an endpoint based on a relative spatial characteristic between two or more lines of the plurality of lines.

Line-based endpoint detection

Charging areas in electron microscopy are identified by comparing images obtained in different frames. A difference image or one or more optical flow parameters can be used for the comparison. If charging is detected, electron dose is adjusted, typically just in specimen areas associated with charging. Dose is conveniently adjusted by adjusting electron beam dwell time. Upon adjustment, a final image is obtained, with charging effects eliminated or reduced.

Charge reduction by digital image correlation

A stackable die mounting system with an efficient interconnect is disclosed that can have a base chip carrier to interconnect a base integrated circuit die to a circuit board on a first side and to a second stacked integrated circuit on a second side. The second side can include a first region having a pad out configuration of a first input output (I/O) to transmit data to be stored by the stacked integrated circuit die. The base chip carrier can have a second region with a pad out of a second I/O that is configured to receive data transmitted by the stacked integrated circuit die wherein the pad out of the second port is translated and rotated about an axis from the pad out of the first region such that a busses with different functions can be vertically integrated from the circuit board.

Growing community of inventors

Portland, OR, United States of America

Brad Larson