Intel Corporation

Brad Bittel

Phani Kumar Kandula

David N Lombard

Mark J Luckeroth

John Kelbert

Nikos Kaburlasos

Eric J M Moret

Eric J Moret

Marc Beuchat

Rodrigo De Oliveira Vivi

Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.

Systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices

Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.

Methods and apparatus to reduce thermal fluctuations in semiconductor processors

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Beaverton, OR, United States of America

Brad Bittel