Intel Corporation

Boxi Liu

James Chris Matayabas, Jr

Hemanth K Dhavaleswarapu

Syadwad Jain

A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.

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Chandler, AZ, United States of America

Boxi Liu