Palo Alto Research Center Inc.

Bowen Cheng

Noble Marshall Johnson

Christopher L Chua

Eugene Michael Chow

Peter Kiesel

Doron Kletter

Joerg Martini

Marshall Bern

Michael I Recht

Thomas Wunderer

Dirk De Bruyker

John E Northrup

Zhihong Yang

Dirk DeBruyker

Brent Shawhan Krusor

Suk Choi

Marshall W Bern

A system is configured to determine a color distribution of an object moving along a flow direction relative to a spatial filter. The light emanating from the object is time modulated according to the mask features of the spatial filter. First and second detectors are arranged to sense the modulated light. The first detector senses light having a first wavelength spectrum and generates a first electrical output signal in response to the sensed light. The second detector light senses light having a second wavelength spectrum and generates a second electrical output signal in response to the sensed light. Signals from the first and second detectors include information about color distribution of the object.

Determination of color characteristics of objects using spatially modulated light

Spatially modulated light emanating from an object moving along a flow path is used to determine various object characteristics including object length along the flow direction. Light emanating from at least one object moving along in a flow path along a flow direction of a spatial filter is sensed. The intensity of the sensed light is time modulated according to features of the spatial filter. A time varying electrical signal is generated which includes a plurality of pulses in response to the sensed light. Pulse widths of at least some of the pulses are measured at a fraction of a local extremum of the pulses. The length of the object along the flow direction is determined based on the measured pulse widths.

Spatial modulation of light to determine object length

A light emitting device includes a p-side heterostructure having a short period superlattice (SPSL) formed of alternating layers of AlGaN doped with a p-type dopant and AlGaN doped with the p-type dopant, where x&#x2264;x&#x2264;0.9. Each layer of the SPSL has a thickness of less than or equal to about six bi-layers of AlGaN.

P-side layers for short wavelength light emitters

Approaches for determining object position in a flow path are disclosed. A system includes a spatial filter having a length disposed along a longitudinal axis of the flow path and a width along a lateral axis of the flow path. The spatial filter has mask features configured to modulate light. Light emanating from objects moving along the flow path is detected. The detected light has a component along a detection axis that makes a non-zero angle with respect to the longitudinal and lateral axes. An electrical output signal that includes information about the trajectory depth of the object is generated in response to the detected light.

Spatial modulation of light to determine object position

A light emitting device includes a p-side heterostructure having a short period superlattice (SPSL) formed of alternating layers of AlGaN doped with a p-type dopant and AlGaN doped with the p-type dopant, where x&#x2266;x&#x2266;0.9. Each layer of the SPSL has a thickness of less than or equal to about six bi-layers of AlGaN.

A light emitting device includes a p-side heterostructure, an n-side heterostructure, an active region disposed between the p-side heterostructure and the n-side heterostructure. An electron blocking layer (EBL) disposed between the p-side heterostructure and the active region comprises an aluminum containing group-III-nitride alloy. An aluminum composition of the EBL decreases as a function of distance along a [0001] direction from the active region towards the p-side heterostructure over a majority of the thickness of the EBL.

Graded electron blocking layer

An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.

Micro-plasma generation using micro-springs

A device includes a spatial filter arranged in a Cartesian coordinate system having orthogonal x, y, and z axes. The spatial filter has mask features that are more light transmissive and mask features that are less light transmissive. The mask features are arranged along the x-axis in the flow direction of a flow path. A detector is positioned to detect light emanating from at least one object in the flow path, the object having a width along the y-axis, a thickness along the z-axis, and a length along the x-axis. Light emanating from the object is time modulated according to the mask features as the object moves along the flow path. The detector is configured to generate a time-varying electrical signal in response to the detected light that includes information about the width or thickness of the object.

Spatial modulation of light to determine dimensional characteristics of objects in a flow path

Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching process. During the etching process, the thickness of the bulk AlN can be measured and used to control etching.

Removing aluminum nitride sections

Micro-plasma is generated at the tip of a micro-spring by applying a positive voltage to the spring's anchor portion and a negative voltage to an electrode maintained a fixed gap distance from the spring's tip portion. By generating a sufficiently large voltage potential (i.e., as determined by Peek's Law), current crowding at the tip portion of the micro-spring creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. Ionic wind air currents are generated by producing multiple micro-plasma events using micro-springs disposed in a pattern to produce a pressure differential that causes air movement over the micro-springs. Ionic wind cooling is produced by generating such ionic wind air currents, for example, in the gap region between an IC die and a base substrate disposed in a flip-chip arrangement.

A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

Stress-engineered interconnect packages with activator-assisted molds

A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

Airgap micro-spring interconnect with bonded underfill seal

A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

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Atherton, CA, United States of America

Bowen Cheng