Nxp B.v.

Nexperia B.v.

Boudewijn Van Blokland

Christian Zenz

Tonny Kamphuis

Bodin Kasemset

Patrick Schoengrundner

Johannes Wilhelmus Van Rijckevorsel

David Ceccarelli

Tom Kok

Tonny Kamphius

Johannes Van Rijckevorsel

A method comprising; transferring a holding liquid into at least one pocket of a carrier tape, the at least one pocket comprising a recess within the carrier tape configured to receive an electronic component; placing an electronic component into the at least one pocket whereby the holding liquid acts to retain the electronic component within the pocket; and applying a sealing tape over the carrier tape to close the pocket with the electronic component therein.

Backend taping using fluid assisted fixation

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Dual interface IC card components and method for manufacturing the dual-interface IC card components

Growing community of inventors

Nijmegen, Netherlands

Boudewijn Van Blokland