Signify Holding B.v.

Philips Lighting Holding B.v.

Koninklijke Philips Corporation N.v.

Lumileds LLC

Boudewijn Ruben De Jong

Marc Andre De Samber

Paul Dijkstra

Hendrik Jan Eggink

Jacobus Petrus Johannes Van Os

Marcus Franciscus Donker

Lu Fei Zhang

Aernout Reints Bok

Pascal Johannes Theodorus Lambertus Oberndorff

Johannes Wilhelmus Weekamp

Adrianus Sempel

Maurice Herman Johan Draaijer

Theodorus Johannes Petrus Van Den Biggelaar

Johannes Franciscus Maria Cillessen

Egbertus Reinier Jacobs

Esther Anna Wilhelmina Gerarda Janssen

Antonius Wilhelmus Maria De Laat

Kenneth Van Kogelenberg

Esther Anna Wilhelminia Gerarda Janssen

The invention provides a method for manufacturing a 3D item () comprising an electrically conductive coil () of at least part of an electrically conductive wire (), wherein the method comprising printing with a fused deposition modeling (FDM) 3D printer () 3D printable material (), wherein the 3D printable material () comprises the electrically conductive wire (), to provide the 3D item () comprising the electrically conductive coil ().

Method for manufacturing a 3D item having an electrically conductive coil

An arrangement () and method for suspending a lighting device is provided. The arrangement comprises a spring element () having a central, U-shaped portion () and a first and a second coil () extending from a respective first and second leg () of the central portion and along an axis (A) parallel to a base () of the portion. The coils, in an unbiased state of the spring element, are spaced apart by a first distance (d) along the axis (A). The arrangement further comprises a housing () comprising a first and a second cavity () spaced apart by the first distance (d) for fitting accommodation of the first and second coil, respectively. The arrangement further comprises a support element () arranged between the first and second cavities and configured to confine the first and second coil within the first and second cavity, respectively.

Arrangement for suspending a lighting device

A packaged light emitting device dieincludes a package body having a profiled leadframeembedded in a bodyof reflecting material. The leadframeis exposed on mounting surfaceonly on at least one solder bonding area. Solderis present only on the at least one solder bonding areaand not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solderto the at least one solder bonding area

Light emitting device package

The present invention relates to a lighting device () comprising a split lighting engine with at least two thermally separated sub-engines (). Each sub-engine comprises at least one solid state light source () and a component () adapted to regulate electric current or power to the at least one solid state light source (), so that the sub-engines () are individually drivable based on a thermal environment of each sub-engine.

Lighting device comprising a split lighting engine

A light source assembly, a method for producing a light source assembly, and a lamp are provided. In one example, the light source assembly comprises a substrate comprising first and second substrate portions being arranged at a tilt angle (&#x3b1;) to each other forming a V-shaped structure, wherein, at the tip of the V-shaped structure, the first portion comprises a first electrical terminal and the second portion comprises a second electrical terminal. The light source assembly further comprises a light source arranged to bridge a terminal gap between the first and second electrical terminals such that the light source is in electrical connection with the first and second electrical terminals.

Light source assembly and method for producing the same

A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.

A system () for receiving electrical power wirelessly comprises a first () and a second electrode (), with sandwiched there between at least one load module () dispersed in a matrix (). Wherein at least the matrix () is applied in wet form.

Wet processed electronic systems

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Eindhoven, Netherlands

Boudewijn Ruben De Jong