Ems-patent Ag

Ems-chemie Ag

Norma Germany Gmbh

Lanxess Deutschland Gmbh

Rhein Chemie Rheinau Gmbh

Botho Hoffmann

Etienne Aepli

Andreas Bayer

Nikolai Lamberts

Heinz G Hoff

Manfred Hewel

Thomas Wiedemann

Mark Pfleghar

Oliver Thomas

Andri Cadalbert

Arda Alkan

Georg Stoeppelmann

Georg Stoppelmann

Philipp Harder

Sepp Bass

Ralph Kettl

Felix Koch

Werner Obrecht

Eduard Schmid

Janos Kertesz

Friedrich Severin Bühler

Hans-Gerhard Fritz

Ralf Hala

Georg Stöppelmann

Friedrich S Buehler

Lorenz Meier

Heinz Caviezel

Takamasa Fujii

Christian Schubert

Paul Schwitter

Hanns-Jörg Liedloff

Fan Jin

Gabriel Garcia

Minoru Hatta

Robert Hans Schuster

Martin Sütterlin

Doris Abt

Mark D Roth

Martin Suetterlin

Viacheslav Vertlib

Martina Hirayama

Bettina Vetterli

Lothar Michael Ploetze

Luc Scherrer

Carsten Gottschalk

Mark Dipl-Ing Pfleghar

Thomas Emerschitz

Thomas Frueh

Paul DiplChem Schwitter

Thomas Dipl-Ing ÜBele

Werner Dipl ChemIng Eth Kägi

Ralph Dipl-Ing Kettl

Heinz Hoff

Clara Antonia Rozin

Alexander Lampe

The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.

Method of manufacturing a mold that is resistant to hypochlorite

The present invention relates to polyamide compounds having high heat aging resistance which, in addition to a specific polyamide, comprise at least one unsubstituted or substituted metallocene, optionally at least one impact modifier and optionally at least one additive. The invention also relates to the use of said polyamide compounds for the production of molds.

Polyamide compounds, molds produced therefrom and use of the polyamide compounds

Thermoplastic polyamide moulding composition consisting of:

Polyamide moulding compositions for glass composites

The present invention relates to filled polyamide moulding compounds with a high heat-ageing resistance which, besides a specific polyamide mixture, also comprise at least one filler, at least one unsubstituted or substituted metallocene and optionally at least one additive. The invention also relates to the use of these polyamide moulding compounds to produce moulded articles.

Filled polyamide moulding compounds, moulded articles produced therefrom, and use of the filled polyamide moulding compounds

The present invention relates to a thermoplastic molding composition comprising:

Polyamide molding compound with low dielectric loss factor

The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous; hypochlorous acid-containing solutions.

Polyamide molding compounds for hypochlorite-resistant applications

A composite containing directly adjoining and firmly bonded sections (I) and (II) of the following type:

Material composites

Thermoplastic moulding composition consisting of

Polyamide moulding composition for extrusion blow moulding

The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155&#xb0; C. and a dielectric loss factor tan &#x3b4; of not more than 8.30&#xd7;10&#x2212;3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

Microwave-resistant mouldings

The present invention relates to a polyamide molding compound which contains the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one specific amorphous or microcrystalline copolyamide constituted by the specific monomers (a1) to (a4); (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 612, PA 6/12, PA 516, PA 614, PA 616, PA 618, PA 1012, PA 1014, PA 1016, PA 1018 and mixtures thereof; and (C) 0 to 20% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The invention also relates to molded articles made of said polyamide molding compound and the use thereof.

Polyamide molding compound

The invention relates to polyamide moulding compounds comprising the following components: a) 50 to 95% by weight of a single amorphous copolyamide constructed from monomers a1) to a6), b) 5 to 50% by weight of at least one glass filler, c) 0 to 15% by weight of at least one monomeric lactam and/or polyamide 12, d) 0 to 19% by weight of additives, the sum of components a) to d) producing 100% by weight. Furthermore, the invention relates to moulded articles made of this polyamide moulding compound.

Glass filler-reinforced polyamide moulding compounds based on amorphous copolyamides

The present invention relates to an amorphous or microcrystalline copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine; (b) 0.25 to 4.4 mol % of at least one dimeric fatty acid; and (c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, and (d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid; where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and optionally (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. The invention further relates to moulding compounds comprising the copolyamide (A), to mouldings made therefrom and to the use thereof.

Copolyamides containing dimeric fatty acid as monomer

Disclosed is a polyamide moulding compound formed from a mixture of partially crystalline, aliphatic polyamides and partially crystalline, partially aromatic polyamides and also fibrous reinforcing materials. The partially crystalline, partially aromatic polyamides are thereby formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or &#x3c9;-amino acid component. The mixture and/or the moulding compound can include further components. Moulded articles produced from these moulding compounds are used, for example, in the automobile sphere, in the household sphere, in measuring, regulating and control technology or in mechanical engineering.

Polyamide moulding compound and moulded articles produced therefrom

The present invention relates to polyamide molding compounds that are characterized by high notch impact resistance and high gloss. These polyamide molding compounds comprise the following components or consist of these components: (A) 84.5 to 97.0 wt % of at least one amorphous or microcrystalline copolyamide selected from the group comprising PA 6I/6T/MACMI/MACMT/PACMI/PACMT/Y, PA 6I/6T/MACMI/MACMT/Y, and mixtures thereof; (B) 3.0 to 9.5 wt % of at least one specific functionalized impact resistance modifier; and (C) 0 to 6 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100 wt %. The present invention furthermore relates to molded bodies composed of this polyamide molding compound.

Polyamide molding compound having high gloss and high notch impact resistance

Growing community of inventors

Domat/Ems, Switzerland

Botho Hoffmann