Evatec Ag

Boris Trajcevski

Martin Kratzer

Kai Wenz

Philip Zeller

A method to deposit a coating including a material with highly oriented microstructure, the method including at least the following sequence of process steps: providing a flat substrate into a first vacuum processing chamber; etching one surface of the substrate by physical vapor etching; depositing a first metallic layer on the etched substrate surface by sputtering in a first metal deposition step; annealing the first metallic layer at an annealing temperature at least 50° C. higher than a compound deposition temperature of the subsequent compound deposition step; depositing a first compound layer at the compound deposition temperature on the outer surface of the first metallic layer by reactive sputtering in a first compound deposition step; and depositing a second metallic layer on the outer surface of the first compound layer by sputtering in a second metal deposition step.

Deposition process for piezoelectric coatings

A vacuum apparatus to deposit a compound layer on at least one plate shaped substrate by sputtering. The apparatus including a vacuum chamber with side walls around a central axis. The chamber includes at least one inlet for a process gas, at least one inlet for an inert gas, a substrate handling opening, a pedestal including an electrostatic chuck formed as a substrate support in a central lower area of a sputter compartment, a magnetron sputter source including the target at the frontside and a magnet-system at the backside of the source, an anode looping around the target and at least an upper part of the pedestal and a pump compartment connected to a bottom of the sputter compartment by a flow labyrinth. A vacuum pump system is connected to the pump compartment.

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Sax, Switzerland

Boris Trajcevski