Juniper Networks, Inc.

Ciena Corporation

Boris Reynov

Shreeram Siddhaye

Jack W Kohn

Venkata S Raju Penmetsa

Ben T Nitzan

Euan F Mowat

Oscar Diaz-Landa

Raanan Ben-Zur

Nicholas A Balatoni

Mahesh Nagarajan

Mark Simpson

Chebrolu S Srinivas

Venkata Penmetsa

Bayne G Steele

Philip Quaife

Steven L Shepherd

Victor W Mei

Lee M Forbes

Mark Devenport

John Cleveland

Dung Viet Nguyen

David Keith Owen

Jing Zhang

Srinivas Venkataraman

Steve M Wilkinson

Michael Clifford Freda

Madhavi Rajan

John Tran

Bruce Thompson

Ping Yue

Bipin Dhavale

Ohm P Mishra

A disclosed apparatus may be a circuit board that includes (1) a first unique sublaminate that includes a plurality of ground layers and a plurality of signal layers, (2) a second unique sublaminate that includes a plurality of power layers and another plurality of signal layers, and (3) a symmetry axis that bisects the circuit board between the first unique sublaminate and the second unique sublaminate, wherein the first unique sublaminate and the second unique sublaminate are distinct from one another. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for mitigating the swiss cheese effect in high-current circuit boards

A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.

Orthogonal cross-connecting of printed circuit boards without a midplane board

In some embodiments, an apparatus includes a set of power supply units where each power supply unit from the set of power supply units is associated with a power zone from a set of power zones. The apparatus can also include a redundant power supply unit and a set of electronic devices where each electronic device from the set of electronic devices is associated with a power zone from the set of power zones. Additionally, each electronic device from the set of electronic devices is operatively coupled to a power supply unit from the set of power supply units for that power zone and is also operatively coupled to the redundant power supply unit.

Methods and apparatus for providing redundant power supply protection with power zones for electronic devices

A network device may include multiple line cards and a switch fabric assembly electrically connected to the line cards. The switch fabric assembly includes: for each of the line cards, a line card connector providing electrical connectivity between the line card and one or more cables; a cable mesh assembly including the cables, the cables providing electrical connectivity between each line card connector and multiple switch connector groups; and multiple switch application specific integrated circuits (ASICs), each of the switch ASICs being electrically connected to one of the switch connector groups.

Computer network switch fabric assembly

The disclosed apparatus may include (1) a plurality of SerDes devices that each facilitate transmitting and receiving communications in connection with a network device and (2) at least one phase-adjustment device communicatively coupled to a first SerDes device included in the SerDes devices, wherein the phase-adjustment device mitigates crosstalk among the SerDes devices by (A) receiving at least one reference clock signal, (B) generating at least one phase-adjusted clock signal based at least in part on the reference clock signal such that the phase-adjusted clock signal and the reference clock signal are out of phase with respect to one another, and (C) delivering the phase-adjusted clock signal to the first SerDes device to ensure that the SerDes devices are switching out of phase with respect to one another. Various other apparatuses, systems and methods are also disclosed.

Apparatus, system, and method for mitigating crosstalk among SerDes devices

A system may include a removable board that is adapted for inserting into and removing from an enclosure, an electronic component that is attached to the removable board, and a cooling system that is attached to the removable board. The cooling system may include a first heat exchanger that is attached to the electronic component by a physical interface. The cooling system may include a coolant pipe that that is at least partially filled with a working fluid to receive heat, generated by the electronic component, via the first heat exchanger. The cooling system may include a second heat exchanger, attached to the coolant pipe and situated to be located outside of the enclosure when the removable board is inserted into the enclosure. The cooling system may be adapted to remain attached to the removable board when inserting and removing the removable board.

Removable board with cooling system for chassis-based electronic equipment

An apparatus may comprise a board that can mechanically support one or more components of the apparatus. The one or more components may include a processor to process a signal received or provided via the apparatus. The apparatus may comprise one or more sets of contacts via which the processor is to receive or provide the signal. The one or more sets of contacts may be associated with permitting the apparatus to function as a connector. The apparatus may comprise one or more electrical connections that provide connectivity between the processor and the one or more sets of contacts.

Electrical connector with embedded processor

An apparatus may include a printed circuit board, an integrated circuit mounted on a first surface of the printed circuit board, and one or more vias that extend through the printed circuit board from the first surface to a second surface of the printed circuit board to provide electrical connectivity for the integrated circuit. The second surface of the printed circuit board may be opposite the first surface of the printed circuit board. The apparatus may include a pin header that mechanically supports one or more pins that provide electrical connectivity for the integrated circuit. The pin header may be mounted to the second surface of the printed circuit board to mate the one or more pins with the one or more vias to provide electrical connectivity for the integrated circuit.

Printed circuit board with connector header mounted to bottom surface

A line card includes a metal frame that includes a front section, and a bottom section connected to the front section via an angled section, where the angled section results in an opening between the line card and a second line card, when the line card is installed above the second line card in a rack, and where the opening allows directed air to enter the rack from a front direction; a printed circuit board attached to the metal frame; and a group of front panel connectors attached to the front section of the metal frame.

Chassis system with front cooling intake

In some embodiments, an apparatus includes a set of power supply units where each power supply units from the set of power supply unit is associated with a power zone from a set of power zones. The apparatus can also includes a redundant power supply unit and a set of electronic devices where each electronic device from the set of electronic devices is associated with a power zone from the set of power zones. Additionally, each electronic device from the set of electronic devices is operatively coupled to a power supply unit from the set of power supply units for that power zone and is also operatively coupled to the redundant power supply unit.

A portable, self-powered, interface converter for converting between Ethernet over twisted pair cables and Ethernet over optical fiber is described. In one implementation, the device may include a first interface to a power-over-Ethernet connection and a second interface to provide a connection to receive fiber optic cabling. A power-over-Ethernet (PoE) circuit may derive power from the PoE connection and output a corresponding power signal. A transcoder may perform physical layer conversion between Ethernet communications over twisted pair cabling connected to the first interface and Ethernet communications over the fiber optic cabling. The transcoder may be powered by the power signal output by the PoE circuit.

Power over ethernet electrical to optical interface converter

A printed circuit board (PCB) defines a first outer surface and a second outer surface that is opposite the first outer surface. The first outer surface of the PCB defines a recess. The PCB includes a signal layer between the first outer surface and the second surface with a first portion exposed within the recess and a second portion exposed within the recess. A component is disposed within the recess and connected to the first portion and the second portion of the signal layer such that an entirety of the component is within the recess and below the first surface.

Apparatus and methods for placement of discrete components on internal printed circuit board layers

In some embodiments, an equipment unit has a set of visual indicators, a power switch, and a set of compute components. The power switch receives a signal representing a status such that when the status is in a first mode, the power switch provides power to the set of visual indicators and when the status is in a second mode the power switch does not provide power to the set of visual indicators. The compute components are configured to receive power when the power switch does not provide power to the set of visual indicators.

Growing community of inventors

Cupertino, CA, United States of America

Boris Reynov