Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Rheinisch-Westfaelische Technische Hochschule Aachen

Rheinisch-Westfalische Technische Hochschule Aachen

Fraunhofer USA, Inc. Center for Laser Technology

Fraunhofer USA, Inc.

Boris Regaard

Stefan Kaierle

Wolfgang Schulz

Stefan Heinemann

Peter Abels

Jan Michel

Anas Moalem

Thorsten Schmidt

The present invention relates to a method and a device for the machining of an object using a tool, in which the tool () or the object () is guided using a handling apparatus, which has multiple movement axes for the coarse positioning of the tool () or object (), which form a kinematic chain. In the method, an additional actuator (), which has a higher positioning precision in at least one dimension or axis than the other movement axes, is inserted between a terminal link () of the kinematic chain and the tool () or object (). A relative movement of the tool () or terminal link () of the kinematic chain to the object () is detected using at least one sensor () and a deviation from a target movement path is compensated for using the additional actuator (). The method and the associated device allow the use of robots or other handling apparatuses having lower path precision for applications which require a high precision during the guiding of the tool.

Method and device for fine positioning of a tool having a handling apparatus

The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece () with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region () containing the impact point of the machining beam () on the workpiece () is illuminated at least approximately coaxially to the machining beam () by means of additional optical radiation (). Radiation () reflected by the machining region () is detected, parallel to an incidence direction of the optical radiation () or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (). From the optical reflection pattern, a course of at least one liquid/solid phase boundary in the machining region () is then determined in an automated manner by means of an image processing algorithm on the basis of a transition from an area containing a large-surface homogeneous area and an area containing a plurality of small-surface homogeneous areas in the optical reflection pattern.

Method for measuring phase boundaries of a material during machining with a machining beam using additional illumination radiation and an automated image processing algorithm, and associated device

The present invention relates to a method for determining a lateral relative movement between a processing head and a workpiece during processing the workpiece as well as a device to carry it out. In the method a surface of the workpiece () is illuminated in the region of the processing head with an optical radiation (). The optical radiation () reflected from the surface of the workpiece () in the region of the processing head is repeatedly detected in a locally resolved manner by an optical detector (), which is firmly fixed mechanically to the processing head, to obtain optical reflection patterns. The repeated detection occurs in temporal intervals in which the temporally successive reflection patterns of overlapping surface regions of the workpiece () are obtained. The lateral relative movement is determined by comparing the temporally successive reflection patterns. The method and the corresponding device permit contactless measurement of the relative movement between the processing head and the workpiece with great precision.

Method and device for determining the lateral relative displacement between a processing head and a workpiece

Array comprising high power laser diode comprising laser light emitters, each defining, in a direction perpendicular to direction of propagation of an output laser beam, a fast axis and a slow axis; fast axis collimating means for collimating output laser beams in fast axis direction; and slow axis beam shaping means for collimating or focussing output laser beams in slow axis direction, said slow axis beam shaping means disposed external to said high power laser diode; wherein said laser light emitters are displaced relative to each other in fast axis direction or in fast and slow axis direction by equidistant spacings, respectively; and including optical means for forming output laser beam profile in far field of all laser light emitters consisting of said fast and slow axis collimated or focussed output laser beams arranged adjacently in seamless manner in one or two dimensions with optical fill factor of about 100%.

High power laser diode array comprising at least one high power diode laser and laser light source comprising the same

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Ypsilanti, MI, United States of America

Boris Regaard