Trumpf Werkzeugmaschinen Gmbh + Co. Kg

Boris Regaard

David Schindhelm

Tim Hesse

Winfried Magg

Volker Rominger

Dieter Hallasch

Oliver Bocksrocker

Ulrich Meindl

Christian Greger

A method determines at least one parameter for a process quality during a processing process. The method includes: processing a workpiece while moving a processing tool and the workpiece relative to one another; monitoring a region on the workpiece; determining the at least one parameter for the process quality based on the monitored region; and determining at least one position-dependent parameter for the process quality based on a plurality of measured values of the at least one parameter at a same processing position, or determining at least one direction-dependent parameter for the process quality based on the plurality of measured values of the at least one parameter in a same processing direction.

Method for determining a parameter of a processing process and processing machine

A method performed by a laser machine includes: before a laser-beam machining process, recording an influence of a change in a position of at least one movable laser machine component on a lateral position of a focal point of a laser beam in a focal plane or relative to a reference point, storing an association between the position of the movable laser machine component and the lateral position, and then, setting, based on the stored association, the focal point to a preset lateral position in the focal plane or relative to the reference point by setting the position of the movable laser machine component. The movable laser machine component can include at least one of at least one optical element in a beam path of the laser beam, a laser-beam machining head in a work area of a laser machine, or a movable part of the laser-beam machining head.

Laser-beam material machining

A device for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece. The device includes a focusing unit for focusing a machining beam, in particular a laser beam, onto the workpiece for the formation of a kerf on the workpiece. The device also includes an image acquisition unit to generate at least one image of a region of the workpiece, and an evaluation unit configured to determine, based on the at least one image, at least one measured variable for the course of the gap width of the kerf in a thickness direction of the workpiece. The invention also relates to an associated method for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece.

Monitoring a thermal cutting process

The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An control apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

Devices and methods for monitoring, in particular for regulating, a cutting process

Described is laser machining nozzles for laser machining devices. The laser machining nozzles includes a body having an inner surface and an outer surface. The inner surface of the laser machining nozzles include at least one subarea. The subarea includes a layer of at least one of the copper oxides CuO and CuO. The layer of CuO and/or CuO has an absorbing effect for radiation at an observation wavelength between 300 and 1100 nm or between 900 and 1700 nm.

Laser machining nozzle for a laser machining device, and laser machining device

A laser processing head comprising a focusing device for focusing a processing laser beam onto a workpiece, the focusing device arranged in a processing beam path, an optical imaging device comprising a detector, wherein the optical imaging device is configured to image observation radiation from a processing region of the workpiece onto the detector along an observation beam path passing through the focusing device, a beam splitter for separating the observation beam path from the processing beam path of the processing laser beam, imaging optics arranged in the observation beam path between the beam splitter and the detector; and a stop arranged between the imaging optics and the detector, wherein the imaging optics produces an image of the stop in the processing beam path of the processing laser beam between the beam splitter and the workpiece.

Laser-processing head and laser-processing machine comprising same

The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

An apparatus includes a focusing element arranged to focus a high-energy beam on a workpiece, an image detector for recording at least one image of an area to be monitored on the surface of the workpiece and/or the reference contour; imaging optics arranged to (a) receive process radiation radiation through the focusing element, from an area of the workpiece and/or the reference contour to be monitored, in the form of a first monitoring beam that is non-coaxial with the high-energy beam between the workpiece and the imaging optics and (b) redirect the first monitoring beam to the image detector to provide the at least one image of the area to be monitored and/or the reference contour; and an evaluation device operable to determine the focus position of the high-energy beam based on the at least one recorded image.

Determining a focus position of a high-energy beam

This disclosure relates to methods and apparatuses for determining a material type and/or a surface condition of a workpiece. A surface of the workpiece is illuminated with illuminating radiation. At least one image of the illuminated surface is recorded. The material type and/or the surface condition of the workpiece is determined on the basis of a statistical analysis of the at least one image converted into a spatial frequency domain.

Determining a material type and/or a surface condition of a workpiece

Methods, devices and systems for detecting an incomplete cutting action when cutting a workpiece with a high-energy beam are disclosed. In one aspect, a method includes taking an image of a region of the workpiece to be monitored, the region including an interaction region of the high-energy beam with the workpiece, evaluating the image taken in order to detect pooled slag at an end of the interaction region opposite a cutting front, and detecting whether a related cutting action is incomplete based on an occurrence of detection of pooled slag.

Detecting an incomplete cutting action

Methods, systems, and devices for establishing a wear state of a cutting nozzle of a laser processing machine. An actual state of the cutting nozzle shape is established by a three-dimensional evaluation performed by a nozzle shape sensor and an associated controller. The established actual state of the cutting nozzle shape is compared to a desired state of the cutting nozzle shape, and the wear state of the cutting nozzle is established based on a result of the comparison.

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Gerlingen, Germany

Boris Regaard