Infineon Technologies Ag

Infineon Technologies Austria Ag

Boris Plikat

Joachim Mahler

Petteri Palm

Klaus Schiess

Stefan Landau

Henrik Ewe

Reimund Engl

Holger Torwesten

Soon Lock Goh

Manfred Schindler

Robert Bergmann

Alvin Wee Beng Tatt

In an embodiment, an electronic component includes a dielectric layer having a first surface and a second surface, one or more semiconductor dies embedded in the dielectric layer and at least one electrically conductive member. The electrically conductive member includes a first portion and a second portion. The first portion includes a foil including a first metal and the second portion includes an electrodeposited layer including a second metal. The first portion and the second portion are embedded in the dielectric layer.

Electronic component

A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Growing community of inventors

Tegernheim, Germany

Boris Plikat