Asml Netherlands B.v.

Boris Menchtchikov

Youping Zhang

Yi Zou

Yana Cheng

Chenxi Lin

Cyrus Emil Tabery

Simon Philip Spencer Hastings

Maxime Philippe Frederic Genin

Wim Tjibbo Tel

Daan Maurits Slotboom

Abraham Slachter

Matthijs Cox

Vadim Yourievich Timoshkov

Koen Wilhelmus Cornelis Adrianus Van Der Straten

Nicolaas Petrus Marcus Brantjes

Maxim Philippe Frederic Genin

A method for predicting yield relating to a process of manufacturing semiconductor devices on a substrate, the method including: obtaining a trained first model which translates modeled parameters into a yield parameter, the modeled parameters including: a) a geometrical parameter associated with one or more selected from: a geometric characteristic, dimension or position of a device element manufactured by the process and b) a trained free parameter; obtaining process parameter data including data regarding a process parameter characterizing the process; converting the process parameter data into values of the geometrical parameter; and predicting the yield parameter using the trained first model and the values of the geometrical parameter.

Method to predict yield of a device manufacturing process

A method for analyzing a process, the method including obtaining a multi-dimensional probability density function representing an expected distribution of values for a plurality of process parameters; obtaining a performance function relating values of the process parameters to a performance metric of the process; and using the performance function to map the probability density function to a performance probability function having the process parameters as arguments.

Method of manufacturing devices

A method for determining a correction relating to a performance metric of a semiconductor manufacturing process, the method including: obtaining a set of pre-process metrology data; processing the set of pre-process metrology data by decomposing the pre-process metrology data into one or more components which: a) correlate to the performance metric; or b) are at least partially correctable by a control process which is part of the semiconductor manufacturing process; and applying a trained model to the processed set of pre-process metrology data to determine the correction for the semiconductor manufacturing process.

Method for controlling a manufacturing process and associated apparatuses

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Redwood City, CA, United States of America

Boris Menchtchikov