Ge Lighting Solutions LLC

Lumination LLC

Boris Kolodin

Gary Robert Allen

Bruce Richard Roberts

Emil Vergilov Radkov

David C Dudik

Joshua Ian Rintamaki

Stanton Earl Weaver, Jr

Srinath K Aanegola

Mark J Mayer

Ivan Eliashevich

Thomas Frederick Soules

Glenn Howard Kuenzler

James Thomas Petroski

Mathew L Sommers

Thomas Elliot Stecher

James Reginelli

Christopher L Bohler

Emil P Stefanov

Chen-Lun Hsing Chen

Yiyu Cao

Anirudha Rajendra Deshpande

Stanton E Weaver

Zena Brown

Michael Hsing

Anan Achyut Setlur

A light emitting apparatus comprises: an LED-based light source; a spherical, spheroidal, or toroidal diffuser generating a Lambertian light intensity distribution output at any point on the diffuser surface responsive to illumination inside the diffuser; and a base including a base connector. The LED based light source, the diffuser, and the base are secured together as a unitary LED lamp installable in a lighting socket by connecting the base connector with the lighting socket. The diffuser is shaped and arranged respective to the LED based light source in the unitary LED lamp to conform with an isolux surface of the LED based light source. The base is operatively connected with the LED based light source in the unitary LED lamp to electrically power the LED based light source using electrical power received at the base connector.

LED lamp with uniform omnidirectional light intensity output

A light source () comprises a light engine (), a base (), a power conversion circuit () and an enclosure (). The light engine () comprises at least one LED () disposed on a platform (). The platform () is adapted to directly mate with the base () which a standard incandescent bulb light base. Phosphor () receives the light generated by the at least one LED () and converts it to visible light. The enclosure () has a shape of a standard incandescent lamp.

LED-based light bulb

A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome.

Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration

A lighting apparatus includes a bilaterally symmetrical light engine comprising first and second light emitting diode (LED) devices or planar LED device arrays facing opposite directions, and an envelope including phosphor spaced apart from and surrounding the bilaterally symmetrical light engine. The phosphor is effective to convert light emitted by the light engine to emission light. The bilaterally symmetrical light engine may be configured to emit light having a bilaterally symmetrical intensity distribution that is uniform except at emission angles within 10&#xb0; of the symmetry plane of the bilaterally symmetrical light engine. Each of the first and second LED devices or planar LED device arrays may comprise at least one hemispherically emitting LED device including an LED chip and an encapsulant encapsulating the LED chip and shaped to refract light emitted by the LED chip into a uniform distribution over a hemispherical solid angle.

Omnidirectional LED based solid state lamp

Provided are a lighting device, a backlighting device, and a display device that comprise a radiation source such as LED and wavelength converting members comprising phosphors. In one embodiment, self-absorption within the devices is suppressed or reduced by placing a selective reflector between two wavelength converting members, and the wavelength converting member emitting light with longer peak wavelength is substantially isolated from the irradiation of another wavelength converting member emitting light with shorter peak wavelength. In other embodiments, the wavelength converting members are arranged in strip configuration; or in adjacent hexagons configuration.

Lighting device having illumination, backlighting and display applications

A disclosed optical testing apparatus comprises: a plurality of optical fibers, each optical fiber having a collection end in optical communication with an output end; and a support member supporting the collection ends of the optical fibers so as to simultaneously view an examination region from different angles. A disclosed optical testing apparatus comprises a plurality of optical fibers having collection ends arranged to simultaneously view an examination region from a plurality of different angles. A disclosed optical testing apparatus comprises a plurality of optical fibers, each optical fiber having a collection end, the collection ends of the optical fibers arranged in fixed spatial relationship respective to one another to simultaneously view an examination region from different angles.

Light distribution measurement system

Systems and methods are described that facilitate providing a user with interchangeable phosphor-coated shells, or envelopes, for generate different shades and intensities of white light from a single UV light source. The interchangeability of the low-cost phosphor-coated envelopes permits the use of a single light engine, which is the more expensive component of a solid state lamp. In this manner, consumers are provided with a greater number of lighting choices at low cost than can be achieved using conventional single-envelope lamps.

LED-based changeable color light lamp

A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

Circuit board for direct flip chip attachment

There is provided a phosphor down converting element based on fluoropolymer resin and a method for fabricating the same. There is further provided a method for using said phosphor down converting element to generate white light from a radiation source. The method for fabricating phosphor down converting element includes preparing an appropriate phosphor powder mixture that is capable of absorbing a first band of wavelengths and emitting a second band of wavelengths being greater in length than the first bands, incorporating the phosphor powder mixture into or on a phosphor carrier element comprising a fluoropolymer material, and molding the phosphor down converting elements into useful shapes. Fluoropolymers are the most chemically inert of all plastics, can withstand both extremely high and low temperatures, and show a resistance to weavering and UV degradation, making fluoropolymers optimal for use as a phosphor carrier.

Phosphor down converting element for an LED package and fabrication method

In a light emitting device, a light emitting chip () includes a stack of semiconductor layers () and an electrode () disposed on the stack of semiconductor layers. A support () has a generally planar surface () supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material () is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (') of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip

An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.

Coated LED with improved efficiency

In a method for fabricating a flip-chip light emitting diode device, epitaxial layers () are deposited on a growth substrate () to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die (). The device die () is flip chip bonded to a mount (). The flip chip bonding includes securing the device die () to the mount () by bonding at least one electrode () of the device die () to at least one bonding pad () of the mount (). Subsequent to the flip chip bonding, a thickness of the growth substrate () of the device die () is reduced.

Growing community of inventors

Beachwood, OH, United States of America

Boris Kolodin