Applied Materials, Inc.

Boris Fuksshimov

Boris Fishkin

Kyle A Brown

Victor Belitsky

Ginetto Addiego

Tom Osterheld

Daniel F Kennedy

Jeff Beeler

Brian J Brown

Charles C Garretson

Jeff P Rudd

In a first aspect of the invention, a polishing device is provided. The polishing device includes a platen adapted to support a polishing pad and also includes a source of polishing slurry. Also included in the polishing device is a slurry supply line adapted to supply the polishing slurry from the source of polishing slurry to the polishing pad. The polishing device includes a pressure transducer installed along the slurry supply line and adapted to detect a pressure inside the slurry supply line. Numerous other aspects are provided.

Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer

The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Combined slurry dispenser and rinse arm

Combined slurry dispenser and rinse arm and method of operation

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San Jose, CA, United States of America

Boris Fuksshimov