Noah Precision, LLC

Oriol Inc.

Other

Boris Atlas

Yefim Bichutskiy

Boris Bruk

A temperature control system, a wafer chuck, a thermal module for use with the chuck, and an apparatus for use in semiconductor manufacture are disclosed herein. The temperature control system includes: a target having a temperature, a fluid circulation loop coupled to the target for controlling the temperature of the target, a heating heat exchanger coupled to the fluid circulation loop for selectively providing heat to the fluid circulation loop, a cooling heat exchanger coupled to the fluid circulation loop for selectively providing cooling to the fluid circulation loop and a plurality of thermal electric elements carried by the target for selectively providing heating or cooling to the target. The heating heat exchanger and cooling heat exchanger provide gross control of the temperature of the target, and the plurality of thermal electric elements provide fine control of the temperature of the target.

Temperature control system for electrostatic chucks and electrostatic chuck for same

A temperature control device for use in a process reactor system with a bubbler having a container provided with a side wall. The device includes a vessel having an internal chamber adapted to receive the container of the bubbler. An enclosure member is extendable between the container of the bubbler and the vessel for enclosing the side wall of the container within the internal chamber. A temperature-changing device is coupled to the vessel for providing heat or cold to the internal chamber.

Temperature control unit for bubblers

An apparatus for use with a process liquid for controlling the temperature of a semiconductor-processing target comprises first and second tanks adapted for holding process liquid, at least one fluid level sensor carried by the first tank for monitoring the amount of process liquid in the first tank, and a valve coupled to one of the at least one fluid level sensor and configured to increases the flow of process liquid from the second tank to the target when the amount of process liquid in the first tank drops to a first predetermined amount. The first tank may include first and second compartments partially separated by a divider with a top whereby process liquid in the first compartment flows over the top of the divider into the second compartment.

Temperature control apparatus and method

A temperature control system having a re-circulation loop that uses valves to selectively circulate a temperature control fluid through a cooling system, through a heating system, or through a through passage so as to controlling the temperature of the temperature control fluid, which, in turn, controls the temperature of a target. A temperature sensor monitors the target's temperature. A controller controls valve operation in response to the temperature measured by the temperature sensor to obtain a predetermined target temperature. Beneficially, the controller controls the target's temperature according to a predetermined temperature profile. Continuous etching along a predetermined temperature profile is possible.

Semiconductor processing temperature control

A compact heat exchanger for adjusting the temperature of a stream of liquid of unknown temperature. The heat exchanger includes a hollow core element provided with a passageway which extends therethrough. The core element has an outer surface extending therealong adjacent the passageway. A plurality of thermal electric elements are spaced apart along the outer surface of the core element for providing heating or cooling to the core element. Each thermal electric element has a heat transfer surface which generally conforms to the outer surface of the core element. An assembly is provided for clamping the plurality of thermal electric elements to the outer surface of the core element and includes a heat transfer member for each thermal electric element. The clamping assembly permits the heat transfer members to move independent of each other. The relative independent movement of the heat transfer members facilitates full engagement of the heat transfer surfaces of the thermal electric elements with the outer surface of the core element during expansion and contraction of the core element.

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San Jose, CA, United States of America

Boris Atlas