Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology Portugal, S.a.

Bora Baloglu

Ramakanth Alapati

Hyun Cho

Ki Yeul Yang

Kyung Han Ryu

Seok Hun Yun

Ronald Patrick Huemoeller

Shaun Bowers

Suresh Jayaraman

Andre Cardoso

Eoin O'Toole

Jose Luis Silva

Luis Alves

Jose Moreira Da Silva

Fernando Teixeira

Marta Sa Santos

In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.

Semiconductor device and method of manufacturing semiconductor device

A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.

Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby

In one example, a semiconductor device comprises a substrate comprising a conductive structure, an electronic component over a top side of the substrate and electrically coupled with the conductive structure, a lid structure over the substrate and over the electronic component, and a vertical interconnect in the lid structure extending to a top surface of the lid structure and electrically coupled with the conductive structure. Other examples and related methods are also disclosed herein.

Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structure

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Oporto, Portugal

Bora Baloglu