Texas Instruments Corporation

Bor-Yen Mao

Clarence W Teng

Cheng-Eng D Chen

Richard L Yeakley

The present invention provides products and methods of forming an epitaxial silicon layer on an implanted buried insulator silicon on insulator structure (10). A silicon film (16) is pre-treated to remove residual oxide and surface damage layers, but in such a way as to not damage the silicon film (16) or insulating layer (14) below the silicon film (16). A layer of amorphous silicon (18) is formed on the silicon film (16) in processes to avoid formation of polycrystalline silicon, and also to avoid damage to the silicon film (16). The layer of amorphous silicon (18) is annealed to form an epitaxial layer of single crystalline silicon (20).

Epitaxial process for silicon on insulator structure

The following detailed description describes a dynamic random access memory (dRAM) cell. The described cell provides a one-transistor/one-capacitor dRAM cell structure and array in which the cell pass transistor is formed on the sidewalls of a trench containing the cell capacitor; the word and bit lines cross over this trench. The trench extends through an epitaxial layer into a substrate. The epitaxial layer and substrate are separated by a layer which serves as a diffusion barrier. This stacking of the transistor on top of the capcitor yields a cell with minimal area on the substrate and solves a problem of dense packing of cells. The diffusion barrier allows for the optimal doping of the epitaxial for operation of the transistor and optimal doping of the substrate for operation of the capacitor. One capacitor plate and the transistor channel and source region are formed in the bulk sidewall of the trench, and the transistor gate and the other plate of the capacitor are both formed in polysilicon in the trench but separated from each other by an oxide layer inside the trench. The signal charge is transferred to the polysilicon capacitor plate transistor with the polysilicon capacitor plate. This connection between source and polysilicon capacitor plate is provided by a buried lateral contact.

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Richardson, TX, United States of America

Bor-Yen Mao