Etron Technology, Inc.

Invention and Collaboration Laboratory Pte. Ltd.

Industrial Technology Research Institute

Exrontechnology, Inc.

Etron Technologies, Inc.

Eton Technology, Inc.

Bor-Doou Rong

Chun Shiah

Tah-Kang Joseph Ting

Chao-Chun Lu

Shi-Huei Liu

Jeng-Tzong Shih

Der-Min Yuan

Ming-Hung Wang

Jen-Shou Hsu

Shih-Hsing Wang

Weng-Dah Ken

Yung-Ching Hsieh

Ching-Chih Hsieh

Jun-Wei Luo

Jen-Shoe Hsu

Ghy-Bin Wang

Po-Hung Chen

Tien-Hsin Chang

Tah Kang Ting

This invention discloses sustainable DRAM with principle power supply voltage which is unified with an external logic circuit. The DRAM circuit is configured to couple with the external logic circuit and with a principle power supply voltage source. The DRAM circuit comprises a first sustaining voltage generator and a DRAM core circuit. The first sustaining voltage generator generates a first voltage level which is higher than a voltage level corresponding to a signal ONE utilized in the DRAM circuit. The DRAM core circuit has a DRAM cell comprising an access transistor and a storage capacitor, and the storage capacitor of the DRAM cell is configured to selectively coupled to the first sustaining voltage generator. Wherein, a voltage level of the principle power supply voltage source to the DRAM circuit is the same or substantially the same as that of a principle power supply voltage source to the external logic circuit.

Sustainable DRAM having principle power supply voltage unified with logic circuit

The present invention relates to DRAM with sustainable storage architecture. The DRAM comprises a DRAM cell with an access transistor and a storage capacitor, and a word line coupled to a gate terminal of the access transistor. During the period between the word line being selected to turn on the access transistor and the word line being unselected to turn off the access transistor, either a first voltage level or a second voltage level is stored in the DRAM cell, wherein the first voltage level is higher than a voltage level of a signal ONE utilized in the DRAM, and the second voltage level is lower than a voltage level of a signal ZERO utilized in the DRAM.

Dynamic memory with sustainable storage architecture

The invention relates to DRAM with sustainable storage architecture. The DRAM comprises a first supplying voltage source generating a voltage level corresponding to signal ONE utilized in the DRAM chip, and a DRAM cell which includes an access transistor and a storage capacitor. Wherein a first voltage level is higher than the voltage level corresponding to signal ONE, and the first voltage level is generated by a first sustaining voltage generator. The first sustaining voltage generator is electrically coupled to the storage capacitor of the DRAM cell during a turning-off period of the access transistor of the DRAM cell. A clean up circuit is provided to mitigate the difference between the voltages of BL/BLB and the targeted reference voltage during the equalization period.

Dynamic memory with sustainable storage architecture and clean up circuit

The invention relates to DRAM with sustainable storage architecture. The DRAM comprises a DRAM cell with an access transistor and a storage capacitor, and a word-line coupled to a gate terminal of the access transistor. During the period between the word-line being selected to turn on the access transistor and the word line being unselected to turn off the access transistor, either a first voltage level or a second voltage level is stored in the DRAM cell, wherein the first voltage level is higher than a voltage level of a signal ONE utilized in the DRAM, and the second voltage level is lower than a voltage level of a signal ZERO utilized in the DRAM.

Dynamic memory with long retention time

A system-in-package module includes a non-memory chip, a bundled memory, and an encapsulation package material. The non-memory chip has a plurality of pads. The bundled memory includes a first memory die and a second memory die side-by-side formed over a substrate, wherein the first memory die includes a first group of pads and the second memory die includes a second group of pads. The encapsulation package material encloses the non-memory chip and the bundled memory, and the non-memory chip is electronically coupling with the bundled memory through the plurality of pads, the first and the second group of pads. The first group of pads corresponds to the second group of pads by rotating a predetermined degree or by mirror mapping.

System-in-package module and manufacture method for a system-in-package module

A bundled memory includes a substrate, a first memory die, a second memory die, a scribe line, and an electrical connection. The first memory die has a first input/output bus, and the second memory die has a second input/output bus, where the first memory die and the second memory die are formed over the substrate. The scribe line is formed between the first memory die and the second memory die. The electrical connection is formed over the scribe line for electrically connecting to the first input/output bus and the second input/output bus, where the electrical connection is electrically connected to an external input/output bus, where a size of the external input/output bus of the bundled memory is larger than or equal to a size of the first input/output bus and a size of the second input/output bus.

Bundled memory and manufacture method for a bundled memory with an external input/output bus

A memory with variable operation voltage is disclosed. The disclosed DRAM comprises a core memory module, a register, and a first voltage adjustment module. The core memory module operates with a first control voltage. The register is used for storing a plurality of control signals and selecting one among the control signals as a voltage control signal according to an input signal. The first voltage adjustment module is respectively electrically connected to the register, the core memory module, and an external voltage, so as to provide the first control voltage according to the voltage control signal and the external voltage.

Memory with variable operation voltage and the adjusting method thereof

A data detecting apparatus and a data detecting method are disclosed in the embodiments of the present invention. The data detecting apparatus operates according to a clock signal with a predetermined period. The data detecting apparatus comprises a plurality of memory cells, a plurality of data lines, a plurality of bit lines, a plurality of sense amplifiers and a pre-charge control circuit.

Data detecting apparatus and methods thereof

A new method to sample a digital input signal is achieved. The method comprises sampling a digital input processed through a first digital buffer. The sampling is at the rising edge of a system clock. The switching threshold of a second digital buffer is updated. The digital input processed through the second digital buffer is sampled. The sampling is at the falling edge of the system clock. The switching threshold of the first digital buffer is updated. A digital sampling circuit is achieved.

Dynamic input setup/hold time improvement architecture

A test method is described in which a signal from a tester enters a memory chip or memory module into a special test mode. The special test mode allows leakage defects connected to bit lines to be detected using bit line sense amplifiers. A first test command is issued by a tester, after which a word line is activated. The tester issues a second test command, delayed from the first test command, during the special test mode to turn-on the memory bit line sense amplifiers. The delayed second test command allows sufficient time for the leakage from defects at the crossing of the bit lines and the word line to charge capacitance of the bit lines and allow detection by the sense amplifiers.

Time controllable sensing scheme for sense amplifier in memory IC test

A built-in calibration device is for a temperature sensor. A voltage divider is configured for receiving one reference voltage with a negative temperature coefficient and generating a plurality of input voltages. Comparing apparatus is connected to the voltage divider and configured for generating a plurality of comparing codes based upon another reference voltage with a positive temperature coefficient and the plurality of input voltages. Controlling apparatus is connected to the comparing apparatus and configured for calibrating the temperature sensor based on the plurality of comparing codes.

Calibrated built-in temperature sensor and calibration method thereof

A method for a deep power down mode is described for a memory chip in which voltage regulators and charge pumps are turned off, memory cell voltages are floated, and support circuit internal power supply voltages are replaced by voltages that are derived from the external chip voltage. Prior to being placed into a deep power down mode, all memory cells are placed into a precharge state from which the memory cell voltages are floated upon entering the deep power down mode. Pass through circuits connect externally derived voltages to the support circuit power supply voltage lines, controlled by a deep power down signal. Maintaining a voltage bias on the support circuits prevents latch up problems when the memory chip is brought out of the deep power down mode.

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Hsinchu County, Taiwan

Bor-Doou Rong