C.c.p. Contact Probes Co., Ltd.

Industrial Technology Research Institute

Bor-Chen Tsai

Chun-Hsun Chu

Wei-Chu Chen

Yii-Tay Chiou

Yen-Wei Lin

Jung-Tai Chen

Chih-Hsiang Ko

Wen-Ying Cheng

Tzong-Che Ho

Ming-Chieh Chou

Lung-Tai Chen

Yen-Chun Chen

Chien-Yu Hsieh

Chih-Feng Chen

Min-An Ching

Ming-Lang Tsai

Ying-Chiang Hu

Yu-Min Cheng

Zong-Yuan Wu

Chin-Sheng Chang

Ting-Chen Pan

Chih-Ting Kao

Ming Jie Chou

Hsin-Chieh Wang

Hao-Wen Chien

Yuan-Hsiang Shen

Shu-Lin Wu

Hsiao-Wei Liu

Li-Chun Lan

Yen-Ching Su

Huei-Che Yu

Chin-Wei Hung

Chih-Hui Hou

Ping-Huan Tsou

Wen-Yuan Chiang

Chih-Jung Wang

Wei-Chao Wang

Yen-Hui Lu

Tsung-Ming Tsai

An electrical connection assembly includes a main body and a spring. One end of the main body is configured to be in contact with a device under test. The spring is sleeved around the main body. Two ends of the spring are respectively defined as a first end and a second end. The first end is abutted against a limiting protrusion, and a concealed section of the main body is correspondingly arranged inside of the spring. The spring has a first tightly-coiled section, an elastic section, and a second tightly-coiled section in sequence from the first end to the second end. A pitch of the spring within the elastic section is greater than a pitch of the spring within the first tightly-coiled section, and the pitch of the spring within the elastic section is greater than a pitch of the spring within the second tightly-coiled section.

Electrical connection assembly

A wearable device and an electrical connector with magnetic attraction are provided. The wearable device includes a first body and a second body. The first body has a first pivotal structure and two inner walls respectively provided with a first magnetic attraction member and a plurality of first terminal structures. The second body has a second pivotal structure, and is provided with a second magnetic attraction member and a plurality of second terminal structures. When the second pivotal structure is pivotally connected to the first pivotal structure, the second body is rotatable relative to the first body, and the first and second magnetic attraction members are moved by following the first and second bodies. When the first and second magnetic attraction members are magnetically attracted to each other so as to fix the first body and the second body, the first terminal structures contact the second terminal structures.

Wearable device and electrical connector with magnetic attraction

An insulator applied in a probe base including a probe mounting hole, the insulator is a sheet structure having plural through holes, and the probe mounting hole is formed at the center of the insulator, and the probe mounting hole and the through hole penetrate from a first surface to a second surface of the insulator, and the regions of the first and second surfaces without the probe mounting hole and the through hole are coplanar. The probe base has a base body and at least a composite assembly, and the base body has at least a testing zone, and the composite assembly is installed in the testing zone and has at least a probe hole for installing a probe, and the insulator is installed into the probe hole.

Insulator applied in a probe base and the probe base

Disclosed are a magnetic automobile vehicle device and its multifunctional module. The magnetic automobile vehicle device obtains electric power from a cigarette lighter slot of an automobile vehicle and includes a first magnet and an impact detector. The impact detector generates a distress signal when the automobile vehicle is collided. The multifunctional module includes a second magnet and an output element coupled to the magnetic automobile vehicle device by magnetic attraction and provided for charging or supplying power to the output element, and the output element has an ultrasonic transmitter, a USB slot or an Oair purifier. Therefore, the device comes with a multifunctional configuration and meets market and consumer requirements.

Magnetic automobile vehicle device and multifunctional module thereof

A connector assembly includes a first connector and a second connector. The first connector is coupled to a first electronic device, and the second connector is coupled to a second electronic device and detachably mated with the first connector. The first connector includes a first housing and a magnetic member. The magnetic member is installed inside the first housing and for generating magnetic field. The second connector includes a second housing and a magnetic sensor disposed in the second housing. The magnetic sensor senses the magnetic field generated by the magnetic member when the second connector is mated with the first connector, so as to drive the second electronic device to power the first electronic device.

Connector assembly

In an electric contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite, an Ag&#x2014;(SnO+InO) composite containing 9&#x2dc;11% of (SnO+InO) or an Ag&#x2014;Cu oxide, composite containing 15&#x2dc;25% of Cu oxide is used. The electrical contact material has a contact resistance of 5&#x2dc;60 milliohms (mohm) and an arc erosion resistance capability up to 2*10&#x2dc;10*10times provided that the Vickers hardness (Hv) of the material is 100&#x2dc;150, the measured current is 1&#x2dc;5 amperes, and the measured voltage is 10&#x2dc;20 volts. Two electrical contacts maintain an arc erosion resisting capability at the condition of a low contact resistance when the electrical contact material is formed on a surface of a metal substrate of an electric connector.

Electrical contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite

A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.

Wafer level sensing package and manufacturing process thereof

A projector projecting several images simultaneously is provided. The projector includes a main body having a first opening and a second opening, and an optical system disposed in the main body and projecting a first image through the first opening and a second image through the second opening. The optical system includes a laser source comprising a plurality of mono laser sources, and a first reflector with a first reflective surface and a second reflective surface corresponding to the first opening and the second opening.

Projector

An electrode and a method for forming the electrode. The electrode comprises: a substrate; and a plurality of metal particles adhering to the substrate. The method comprises steps of: providing a substrate; providing a solution including a solvent and a plurality of metal particles on the substrate; removing the solvent; and making the plurality of metal particles adhere to the substrate.

Electrode and method for forming the same

A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

Fiber waveguide optical subassembly module

A parallel optical subassembly module structure comprises an opto-electronic device array, a base with a reflecting slope, and a micro-lens array plate with an inclined plane provided with a specific angle. The optical signal emitted from the opto-electronic device array reflects by the reflecting slope and is incident into the inclined plane of the micro-lens array plate with the specific angle. The inclined plane rectifies the optical signal to output in horizontal direction. Then the optical signal couples with the external fibers through each micro lens of the micro-lens array. The pathway of receiving the optical signal is the same as described above, but in reverse direction.

Parallel optical subassembly module structure

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Taipei, Taiwan

Bor-Chen Tsai