The Boeing Company

Hughes Electronics Corporation

Boon Wong

Robert Edward Silhavy

Jennifer Shinno

Tzu Guu Teng

A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film metallization. The thin-film metallization is a multilayered structure having an adhesion layer overlying and in contact with the thick-film metallization, a readily wettable base-metal layer overlying and in contact with the adhesion layer, and an oxidation-prevention layer overlying and in contact with the base-metal layer. An electrical conductor is soldered to the thin-film metallization of the ceramic substrate. The electrical conductor may be a bonding pad of a flip chip having a solder bump thereon.

Method of forming a soldered electrical connection

A method of making a lightweight, microwave electronic structure includes the steps of forming a rigid, glass structure having a desired density by a sol-gel process and thereafter uniformly coating the formed glass structure with an adherent and uniform conductor. The sol-gel process may be carried out by polymerizing a mixture comprising silicon alkoxide, water and an alcohol. The coating process may be carried out by coating the glass structure with a solution comprising an organic compound of a metal dissolved in an organic solvent and thereafter volatizing the organic solvent.

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Torrance, CA, United States of America

Boon Wong