Applied Materials, Inc.

Boon Sen Chan

Siamak Salimian

Sidda Reddy Kurakula

Yash Chhabra

Abyaya Dhar

Chandrasekhar Roy

Yi Nung Wu

Dien-Yeh Wu

Yao-Hung Yang

Sudhir R Gondhalekar

Yixing Lin

Aniruddha Pal

Chien-Min Liao

Hsiu Yang

Eric Ruhland

Chih Chuan Wang

Saurabh M Chaudhari

Joseph Liu

Chi-Feng Liu

Scott Lin

Philip Wayne Nagle

Yenwei Hung

The present disclosure includes edge defect detection via image analytics. A method includes identifying an image of an edge of a susceptor pocket formed by a susceptor of a substrate processing system. The method further includes predicting, based on the image, whether property values of the edge of the susceptor meet threshold values. The method further includes, responsive to the property values of the edge meeting threshold values, causing performance of a corrective action associated with the susceptor.

Edge defect detection via image analytics

A method includes identifying an image of a substrate processing equipment part that forms a plurality of holes. The method further includes determining, by a processing device based on the image, a corresponding neighboring angular distance of each of the plurality of holes and a corresponding area of each of the plurality of holes. The method further includes identifying, by the processing device, a first subset of the plurality of holes that are at least partially clogged based on at least one of the corresponding neighboring angular distance or the corresponding area of each of the plurality of holes. A corrective action associated with the substrate processing equipment part is to be performed based on the first subset of the plurality of holes that are at least partially clogged.

Clog detection via image analytics

Seal for an assembly in a vapor deposition chamber

Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.

High throughput and metal contamination control oven for chamber component cleaning process

Growing community of inventors

Singapore, Singapore

Boon Sen Chan