Intel Corporation

Other

Boon Ping Koh

Min Suet Lim

Khang Choong Yong

Wil Choon Song

Eng Huat Goh

Tin Poay Chuah

Yew San Lim

Bok Eng Cheah

Jiun Hann Sir

Jackson Chung Peng Kong

Amit Kumar Srivastava

Kooi Chi Ooi

Jeff Ku

Telesphor Kamgaing

Robert L Sankman

Stephen H Hall, Jr

Twan Sing Loo

Kai Chong Ng

Florence Su Sin Phun

Nik Mohamed Azeim Nik Zurin

Phaik Kiau Tan

Wei Jern Tan

Particular embodiments described herein provide for an electronic device that includes an electronic component, a support structure that includes a radiation source, a radiation shield on the support structure. The radiation shield includes a wall and the wall is not continuous around the radiation source and includes a radiation shield gap, where the electronic component covers the radiation shield gap to complete the radiation shield wall.

Radiation shield with radiation shield gap

There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements. The interleaved and interlocked first and second plurality of electrically conductive coupling elements may form a plurality of conductive-bridges and the interleaved and interlocked first and second plurality of non-electrically conductive coupling elements may form a plurality of insulation-bridges.

Flexible printed circuit board arrangement

Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.

Radiation shield and groove in support structure

Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion.

Radiation shield with zipper

Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.

RFI free picture frame metal stiffener

Embodiments disclose electronic packages with a die assembly and methods of forming such electronic packages. In an embodiment, a die assembly comprises a first die and a second die laterally adjacent to the first die. In an embodiment, the first die and the second die each comprise a first semiconductor layer, an insulator layer over the first semiconductor layer, and a second semiconductor layer over the insulator layer. In an embodiment, a cavity is disposed through the second semiconductor layer. In an embodiment, the die assembly further comprises a bridge substrate that electrically couples the first die to the second die, where the bridge is positioned in the cavity of the first die and the cavity of the second die.

Disaggregated die interconnection with on-silicon cavity bridge

Embodiments herein disclose techniques for apparatuses and methods for making a slot antenna on a PCB with a cutout. A PCB may include a metal layer. The metal layer may include a cavity to be a first radiating element of an antenna, and a slot to be a second radiating element of the antenna. In addition, the cavity may extend to be the cutout of the PCB through other layers of the PCB. The first and second radiating elements may provide a determined transmission frequency for the antenna. The metal layer may further include a portion of a transmission line of the antenna, and the transmission line is in contact with the cavity and the slot. A package may be affixed to the PCB, where a portion of the package may be within the cutout of the PCB. Other embodiments may be described and/or claimed.

Slot antenna on a printed circuit board (PCB)

A semiconductor apparatus includes a floating-bridge interconnect that couples two semiconductive devices that are arranged across a middle semiconductive device. The floating-bridge interconnect can be semiconductive material such as a silicon bridge, or it can be an organic bridge. Computing functions required in one of the two semiconductive devices can be off-loaded to any of the floating-bridge interconnect or the other of the two semiconductive devices.

Floating-bridge interconnects and methods of assembling same

An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.

Rod-based substrate with ringed interconnect layers

Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.

Flexible printed circuit EMI enclosure

A system-in-package includes a package substrate that at least partially surrounds an embedded radio-frequency integrated circuit chip and a processor chip mated to a redistribution layer. A wide-band phased-array antenna module is mated to the package substrate with direct interconnects from the radio-frequency integrated circuit chip to antenna patches within the antenna module. Additionally, fan-out antenna pads are also coupled to the radio-frequency integrated circuit chip.

Systems in packages including wide-band phased-array antennas and methods of assembling same

A folded circuit board includes a first circuit board and a second circuit board. The first circuit board and second circuit board are coupled together through a flexible interconnect. One or more folding guides are coupled to one of the first circuit board or second circuit board. The one or more folding guides extend beyond a first edge of the one of the first circuit board or second circuit board. The one or more folding guides include a curved sidewall configured to guide the flexible interconnect when the first circuit board is folded over the second circuit board. In one embodiment, the one or more folding guides are grounded to reduce EMI emissions.

Growing community of inventors

Seberang Jaya, Malaysia

Boon Ping Koh