Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Avago Technologies Ecbu IP Pte. Ltd.

Other

Intellectual Discovery Co., Ltd.

Avago Technologies Imaging IP (singapore) Pte.ltd

Boon Keat Tan

Jin Ho Choi

Ah Ron Lee

Chin Hin Oon

Deog Soon Choi

Farn Hin Chen

Young Ho Lee

Chi Mun Ho

Kean Loo Keh

Gim Eng Chew

Qian Tao

James Costello

Kheng Hin Toh

Richard Lum Kok Keong

Tak Meng Cheang

Susan Hunter

Dominique Ho

Chung Min Thor

Len Li Kevin Lim

Sumio Shimonishi

Jiin Cheang Cheong

Saiful Bahari Saidan

Sze Yin Lee

Chris Tao

Yee Loong Chin

Choon Guan Ko

Fook Chuin Ng

Siang Leong Foo

Gek Yong Ng

Siang Ling Oon

Kevin Len Li Lim

Rani Ramamoorthy Saravanan

Cherng Woei Heng

Eit Thian Yap

Selvan Maniam

Yoke Peng Boay

Lee Ling Teh

Scott Weitzel

Siong Lee Loh

Ju Chin Poh

Yean Loon Ng

Felix Cheang

Jlin Cheang Cheong

Joh Joh Ng

Kevin Len Lim

A system module package is disclosed. The system module package includes: a substrate; a first electrical component and a second electrical component disposed on a top surface of the substrate; and a plurality of bond wires disposed adjacent to at least a first side of the first electrical component and in between the first and second electrical components. The plurality of bond wires are configured to attenuate EMI of a frequency of interest traveling from the first electrical component toward the second electrical component, or from the second electrical component toward the first electrical component. Each of the plurality of bond wires has at least a first end that is mechanically coupled to the top surface of the substrate and has a highest point that is a height, H, from the top surface of the substrate. The plurality of bond wires is of substantially equal lengths measured from the top surface of the substrate to the highest points of the plurality of bond wires in a direction substantially normal to the top surface of the substrate.

Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages

An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.

Isolation device

A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.

A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package and a substantially horizontal conductive structure that is coupled to the conductive fence. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.

An optical sensor and optical system are disclosed. The optical sensor is disclosed to include a light source, a photodetector having a proximity sensing portion and an ambient light sensing portion, and a controller configured to implement a proximity sensing phase where the proximity sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is ON and then implement an ambient light sensing phase where the ambient light sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is OFF.

Matrix arrangement of photodetector for use as a proximity sensor and ambient light sensor

An optical sensor, optical system, and proximity sensor are disclosed. An illustrative proximity sensor is disclosed to include a light source and a photodetector including a photo-sensitive area that receives incident light and converts the received incident light into an electrical signal. The light source and photodetector are positioned diagonally relative to one another, thereby enabling the devices to be positioned closer together on a body or substrate.

Miniaturized optical proximity sensor

An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The plurality of metal layers have a topmost metal layer disposed furthest away from the substrate and a first interconnect metal layer formed nearest to the substrate. The first interconnect metal layer is disposed at a first distance away from the substrate, whereas the topmost metal layer is disposed at an isolation distance away from a first adjacent metal layer formed nearest to the topmost metal layer. A portion of the topmost metal layer forms a first plate. The first plate is configured to transmit the first signal from the first circuit to a second plate that is connected to the second circuit, but electrically isolated from the first plate.

An isolation device for isolating a first signal of a first circuit from a second circuit disclosed. The isolation device may have a substrate and a plurality of metal layers disposed on the substrate. The isolation device comprises a first plate that is electrically coupled to the first circuit, and a second plate that is electrically coupled to the second circuit. The first plate is configured to transmit the first signal from to a second plate that is electrically isolated from the first plate. The first plate and the second plate is surrounded by an isolation material. The isolation device further comprises at least one trench that extend at least partially through the isolation material in a direction that is substantially perpendicular to the first plate and the second plate. The at least one trench may circumscribe one of the first plate and the second plate.

An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a gap. Layers of infrared opaque, attenuating or blocking material are disposed on at least some of the external surfaces forming the gap to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimize optical crosstalk and interference between the light emitter and the light detector.

Infrared attenuating or blocking layer in optical proximity sensor

In one embodiment, an ambient light sensor with first and second photo-detectors is disclosed. The first and second photo-detectors may have different depths and respond differently to light having a specific wavelength. The ambient lights sensor may further comprise a circuit configured to detect light of a specific wavelength. In another embodiment, the first and second photo-detectors may be configured such that each of the first and second photo-detectors detects coupling current from each other. In yet another embodiment, in addition to the first and second photo-detectors, a third photo-detector may be formed proximate to at least one of the first and second photo-detectors such that coupling photo-current is detected therein by the at least one of the first and second photo-detectors.

Optical sensor with special discrimination

In an embodiment, the invention provides a method of color control in a backlighting system comprising a plurality of light sources, a plurality of color sensors, a plurality of PWM controllers, and a video input for receiving video data. The plurality of light sources is activated during a first operative mode to produce white light. The plurality of light sources is controlled during a second operative mode to produce white light.

Color control of a backlighting system

A keypad illumination apparatus having a key plate member, a flexible light guide film, a reflective layer, a plurality of metal domes, a light source and a substrate. The key plate member may have a plurality of keys formed thereon. The flexible light guide film is configured to transmit light from the light source and has a plurality of plunging structures and apertures to accommodate the plurality of metal domes, which may be configured to actuate a plurality of electrical switches on the substrate.

Keypad illumination apparatus

Growing community of inventors

Penang, Malaysia

Boon Keat Tan