Asm Technology Singapore Pte Ltd

Boon June Yeap

Ka Shing Kenny Kwan

Sathish Kumar Balakrishnan

Kumaresh Govindan Radhakrishnan

Rong Duan

Keng Yew James Song

Shi Jie Chen

Jie Wei Hu

A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

Apparatus for increasing coverage of shielding gas during wire bonding

A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.

Thermal insulation for a bonding tool

An apparatus to prevent oxidation of an electronic device, such as a semiconductor substrate during a semiconductor packaging process, comprises a substantially-enclosed conduit having at least one movable support defining a path through which the electronic device may travel and a plurality of gas outlets to introduce a relatively inert gas into the conduit. Conveying means adapted to engage and move the electronic device along the conduit is provided, and an opening along a portion of the conduit allows engagement between the conveying means and the electronic device. Actuating means are adapted to shift the movable support whereby the size of the path is adjustable to suit different electronic devices.

Conduit for preventing oxidation of a electronic device

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Singapore, Singapore

Boon June Yeap