Advanced Micro Devices Corporation

Boon Hee Wee

Thean Loy Yap

Seok Hiong Tan

The present invention provides test contact systems and associated integrated circuit device testing systems, and integrated circuit device testing methods that reduce the number of integrated circuit devices that are lost through handler mishap. The invention provides a test contact system in which a contacting force, or a substantial portion thereof, is exert against the substrate of a device under test, rather than exerting the entire force against the die. The invention also provides a system for adjusting the distribution of the contacting force between the substrate and the die. This mechanism allow the force against the die to be kept within a range that provides good thermal contact between the die and the test contact mechanism without damaging the die. The balance of the contacting force can be transmitted to the substrate of the device under test through a resilient member, thereby further reducing the risk of damage to the device under test. The invention further provides a vacuum seal comprising a foam type material to which devices under test do not stick, which substantially eliminates handler jambs resulting from devices under test sticking to the vacuum seal. The test contact systems of the invention, and associated testing systems and methods, significantly reduce the number of integrated circuit devices damaged during testing.

Test contact mechanism

An IC package test handler is designed for minimized maintenance. The IC package test handler includes a test handler housing comprised of a thermal insulating material for carrying a chilled water jacket. A test handler base cartridge that is replaceable is mounted to a bottom of the test handler housing and contacts an IC package when the IC package test handler is holding the IC package to a socket of an IC package test station. The test handler base cartridge is comprised of a thermally conductive material and includes a heating element and a temperature sensor embedded therein. A cylinder piston is disposed on top of the chilled water jacket. A temperature controller decreases an amount of compressed air provided to the cylinder piston to retract the cylinder piston away from the chilled water jacket such that the chilled water jacket does not contact the test handler base cartridge, and controls the heating element to heat up the test handler base cartridge, to increase the temperature of the IC package when the temperature at the IC package as sensed by the temperature sensor is below a desired temperature. Alternatively, the temperature controller increases an amount of compressed air provided to the cylinder piston to extend the cylinder piston toward the chilled water jacket such that the chilled water jacket contacts the test handler base cartridge, and controls the heating element to turn off, to decrease the temperature of the IC package when the temperature at the IC package as sensed by the temperature sensor is above the desired temperature.

Design of IC package test handler with temperature controller for minimized maintenance

A design for a picker nest which protects any fragile component, such as a bare IC die, mounted on an IC package when the picker nest is holding the IC package for testing. The picker nest of the present invention includes a picker nest head having a picker nest opening with a vacuum suction. The fragile component fits within the picker nest opening as the picker nest is holding the IC package such that no contact force is exerted on the fragile component. The picker nest of the present invention also includes a conductive seal surrounding the perimeter of the picker nest opening for sealing in the vacuum suction within the picker nest opening. The conductive seal is a silicon-based sponge for effectively sealing in the vacuum suction at various temperatures. At least one supporting bar disposed on the picker nest head exerts a force against the IC package substrate toward test contacts of the testing system during testing of the IC package to ensure proper contact of the IC package pins to the test contacts. The conductive seal, the at least one supporting bar, and the picker nest head are comprised of a conductive material to further ensure ESD (Electro Static Discharge) protection for the IC package during testing.

Picker nest for holding an IC package with minimized stress on an IC component during testing

Picker nest for holding an IC package with minimized stress on an IC

A boat retrieval mechanism, which move an output boat containing a tested integrated circuit package within an IC package handler of an IC package testing system, is designed for low maintenance and for easy maintenance. The boat retrieval mechanism of the present invention includes a carrier linear guide having a boat carrier mounted thereon for defining a path of travel of the boat carrier between a core testing unit and an IC package sorting unit. The boat carrier carries the output boat containing a tested IC package from the core testing unit to the sorting unit. A boat self-alignment mechanism disposed near the sorting unit holds the output boat substantially in a predetermined position when the output boat is at the sorting unit. In addition, a grounding wire is coupled between the boat carrier and a ground potential for ESD (Electro-Static Discharge) protection of any tested IC package carried by the boat retrieval mechanism of the present invention. A belt attached to the boat carrier moves the boat carrier, and a motor which drives this belt is located substantially far from the core testing unit for easy access during maintenance.

Growing community of inventors

Singapore, Singapore

Boon Hee Wee