Korea Advanced Institute of Science and Technology

Boogyo Sim

Minsu Kim

Joung-Ho Kim

HyunWook Park

Taein Shin

Gapyeol Park

Keeyoung Son

Seongguk Kim

Subin Kim

Kyungjune Son

Shinyoung Park

Seungtaek Jeong

A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.

Semiconductor package including embedded cooling structure

Growing community of inventors

Daejeon, South Korea

Boogyo Sim