Taiwan Semiconductor Manufacturing Comp. Ltd.

Boo Yeh

Sai-Hooi Yeong

Yen-Ming Chen

Min-Chang Liang

Jui-Yao Lai

Ying-Yan Chen

Kuo-Yen Liu

A semiconductor device includes a plurality of lower conductive lines overlying a substrate and extending in a first direction, an insulating layer overlying the plurality of lower conductive lines, a plurality of upper conductive lines overlying the insulating layer and the first conductive lines and extending in a second direction crossing the first direction, and a plurality of vias filled with a conductive material formed in the insulating layer. The plurality of upper conductive lines are arranged in the first direction with a first pitch. The plurality of vias includes first vias and second vias. At least one via of the first vias connects at least two lines of the plurality of lower conductive lines and one line of the plurality of upper conductive lines. An average width in the first direction of the first vias is different from an average width in the first direction of the second vias.

Method of manufacturing via structures of semiconductor devices

Method of manufacturing semiconductor device with multi wire structure

Semiconductor device and manufacturing method thereof

Growing community of inventors

Hsinchu, Taiwan

Boo Yeh