Globalfoundries Singapore Pte. Ltd.

Agency for Science, Technology and Research

Boo Yang Jung

Juan Boon Tan

Wanbing Yi

Danny Pak-Chum Shum

Bharat Bhushan

Shan Gao

Jason Au

Methodologies and an apparatus for enabling magnetic shielding of stand alone MRAM are provided. Embodiments include placing MRAM dies and logic dies on a first surface of a mold frame; forming a top magnetic shield over top and side surfaces of the MRAM dies; forming a mold cover over the MRAM dies, FinFET dies and mold frame; removing the mold frame to expose a bottom surface of the MRAM dies and FinFET dies; and forming a bottom magnetic shield over the bottom surface of the MRAM dies.

Magnetic shielding of STT-MRAM in multichip packaging and method of manufacturing the same

Various embodiments may provide a method of forming a semiconductor packaging structure. The method may include forming a plurality of semiconductor packages, each semiconductor package including a semiconductor die and a mold encapsulation structure. The method may also include arranging the plurality of semiconductor packages to form a vertical stacked arrangement with a mold portion including a plurality of mold encapsulation structures, the mold portion extending from a first side to a second side of the vertical stacked arrangement opposite the first side. The method may additionally include forming a first via on the mold portion at the first side of the vertical stacked arrangement, forming a second via on the mold portion at the second side of the vertical stacked arrangement, and forming an electrically conductive filled via extending through the mold portion from the first side to the second side of the vertical stacked arrangement.

Semiconductor packaging structure and method of forming the same

Methods of magnetically shielding an MRAM structure on all six sides in a thin wire or thin flip chip bonding package and the resulting devices are provided. Embodiments include forming a first metal layer embedded between an upper and a lower portion of a PCB substrate, the first metal layer having a pair of metal filled vias laterally separated; attaching a semiconductor die to the upper portion of the PCB substrate between the pair of metal filled vias; connecting the semiconductor die electrically to the PCB substrate through the pair of metal filled vias; removing a portion of the upper portion of the PCB substrate outside of the pair of metal filled vias down to the first metal layer; and forming a second metal layer over and on four opposing sides of the semiconductor die, the second metal layer landed on the first metal layer.

Magnetic shielding package structure for MRAM device and method for producing the same

Growing community of inventors

Singapore, Singapore

Boo Yang Jung